二甲硅油 | 63175-14-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 中文名称: 二甲硅油
• 中文别名: 聚乙烯醇缩丁醛；二甲聚硅氧烷；O-β-萘氧基羰基碘化胆碱；甲基硅油201-100cs；O-Β-萘氧羰基碘化胆碱；硅油
• 英文名称: O-beta-Naphthyloxycarbonylcholine Iodide
• 英文别名: trimethyl(2-naphthalen-2-yloxycarbonyloxyethyl)azanium;iodide
• CAS: 63175-14-4
• 化学式: C16H20INO3
• 分子量: 401.24
• InChiKey: MJOPOXYNSSGQHL-UHFFFAOYSA-M

计算性质

• 辛醇/水分配系数(LogP)：
  0.07
• 重原子数：
  21
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  4

安全信息

• WGK Germany：
  3
• 海关编码：
  2923900090

文献信息

• Gypsum board with a fluorine-containing antifungal agent
  申请人：Toreki William

  公开号：US20090104144A1

  公开（公告）日：2009-04-23

  A novel gypsum board having improved antifungal properties is disclosed. The board comprises a gypsum core, front and back paper facings, and a polymeric antifungal agent effective at inhibiting fungal growth. A preferred polymeric antifungal agent is polyDADMAC or polyTMMC. The novel gypsum board further comprises a non-polymeric antifungal agent comprising a fluorine-containing quaternary ammonium compound. Preferred non-polymeric ammonium compounds include Tetra-n-butylammonium fluoride and Tetraethylammonium fluoride. The polymeric antifungal agent can be present in the gypsum core and/or on one or both of the paper facings. The non-polymeric antifungal agent may be encapsulated in a material or ionically associated with the polymeric antifungal agent to allow releases of the non-polymeric antifungal agent over time and/or upon exposure to moisture. Methods for preparing the aforementioned novel gypsum board are also disclosed.

  揭示了一种具有改进抗真菌性能的新型石膏板。该板包括石膏芯、正面和背面纸面以及一种聚合物抗真菌剂，有效地抑制真菌生长。首选的聚合物抗真菌剂是聚DADMAC或聚TMMC。该新型石膏板还包括一种非聚合物抗真菌剂，包括含氟季铵化合物。首选的非聚合物铵化合物包括四正丁基氟化铵和四乙基氟化铵。聚合物抗真菌剂可以存在于石膏芯中和/或在正面和/或背面纸面的一侧或两侧。非聚合物抗真菌剂可以封装在材料中或离子地与聚合物抗真菌剂结合，以允许随时间释放非聚合物抗真菌剂和/或在暴露于湿气时释放。还公开了制备上述新型石膏板的方法。
• Antifungal gypsum board
  申请人：Toreki William

  公开号：US20060194072A1

  公开（公告）日：2006-08-31

  A novel improved gypsum board having improved antifungal properties is disclosed. The board comprises a gypsum core, front and back paper facings and a polymeric antifungal agent effective at inhibiting fungal growth. A preferred polymeric antifungal agent is polyDADMAC or polyTMMC. In addition to the polymeric antifungal agent, a non-polymeric antifungal agent, such as cetyl pyridinium chloride, sodium or zinc pyrithione, or both, may be included. The polymeric antifungal agent can be present in the gypsum core and/or on one or both of the paper facings. In addition, the antifungal agent may be encapsulated in a material or ionically associated with the polymeric antifungal agent, that releases the antifungal agent over time and/or upon exposure to moisture. Also disclosed are methods for preparing the aforementioned improved antifungal gypsum board.
• Gypsum Board Containing Antimicrobial And Antibacterial Compounds
  申请人：Toreki William

  公开号：US20100311865A1

  公开（公告）日：2010-12-09

  A novel gypsum board having improved antimicrobial and antibacterial properties is disclosed. The board comprises a gypsum core, front and back paper facings, and a polymeric antimicrobial or antibacterial compound effective at inhibiting fungal growth. Preferred polymeric antimicrobial and antibacterial compounds include polyDADMAC, polyTMMC, and quaternized polyvinyl pyridine derivatives. The novel gypsum board further comprises a non-polymeric antimicrobial or antibacterial compound. Preferred non-polymeric antimicrobial or antibacteral compounds include cetyl pyridinium chloride and sodium pyrithione. The polymeric antimicrobial or antibacterial compound can be present in the gypsum core and/or on one or both of the paper facings. The non-polymeric antimicrobial or antibacterial compound may be encapsulated in a material or ionically associated with the polymeric antimicrobial or antibacterial compound to allow releases of the non-polymeric antimicrobial or antibacterial compound over time and/or upon exposure to moisture. Methods for preparing the aforementioned novel gypsum board are also disclosed.
• US7473474B2
  申请人：——

  公开号：US7473474B2

  公开（公告）日：2009-01-06
• US8007921B2
  申请人：——

  公开号：US8007921B2

  公开（公告）日：2011-08-30

表征谱图