申请人:W.L. GORE & ASSOCIATES, INC.
公开号:EP0841698A2
公开(公告)日:1998-05-13
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base. a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.
本发明涉及一种对半导体晶圆进行可靠性筛选的系统和方法,特别是涉及一种高平面烧录装置和方法,其用途包括晶圆级烧录(WLBI)、晶粒级烧录(DDBI)和封装晶粒级烧录(PDBI)。该预烧系统包括一个带有平面基底的预烧基板、一个临时 Z 轴连接件和一个 Z 轴晶圆级接触片,它们彼此电连接,用于筛选晶圆、晶粒和封装电子元件,以及它们的装配和使用。