3-tert-Pentyl-[2]naphthol

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 3-tert-Pentyl-[2]naphthol
• 英文别名: 3-Hydroxy-2-tert.-pentyl-naphthalin；3-(2-Methylbutan-2-yl)naphthalen-2-ol
• 化学式: C₁₅H₁₈O
• 分子量: 214.307
• InChiKey: IREDLAAHEHXFSA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5
• 重原子数：
  16
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  2-甲基-2-丁醇 、 2-萘酚 在 zinc(II) chloride 作用下， 生成 3-tert-Pentyl-[2]naphthol
  参考文献：
  名称：

  Branch-chain alkyl derivatives of beta-naphthol

  摘要：

  公开号：

  US02073996A1

文献信息

• Hydroformylation process and bisphosphite compound used therein
  申请人：Mitsubishi Chemical Corporation

  公开号：EP0518241A2

  公开（公告）日：1992-12-16

  A hydroformylation process for preparing a hydroformylated product by reacting an olefinic compound with hydrogen and carbon monoxide in the presence of a Group VIII metal catalyst, in the reaction of which there is present a phosphite compound having the formula (I),         A¹⁅O-P(OR¹)(OR²)]n   (I) wherein R¹ and R² are respectively an aromatic hydrocarbon group which may be the same or different and the aromatic hydrocarbon group has at least a hydrocarbon group on a carbon atom adjacent to a carbon atom bonded with an oxygen atom as a substituent; A¹ is an n-valent organic group having an aliphatic hydrocarbon group, a cycloaliphatic hydrocarbon group or an aromatic hydrocarbon group bonded with an adjacent oxygen atom, which may respectively have a substituent; n is an integer of from 2 to 4; and the respective         ⁅O-P(OR¹)(OR²)] group may be the same or different.

  一种加氢甲酰化工艺，在第八族金属催化剂存在下，通过使烯烃化合物与氢气和一氧化碳反应制备加氢甲酰化产物，在反应中存在具有式（I）的亚磷酸酯化合物、 A¹⁅O-P(OR¹)(OR²)]n (I) 其中 R¹ 和 R² 分别是芳香烃基团，可以相同或不同，芳香烃基团在与氧原子键合的碳原子相邻的碳原子上至少有一个烃基作为取代基；A¹ 是具有脂肪族烃基、环脂族烃基或与相邻氧原子键合的芳香烃基的 n 价有机基团，可分别具有取代基；n 是 2 至 4 的整数；以及各自的 ⁅o-p(或¹)(或²) 组可能相同，也可能不同。
• COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
  申请人：DIC CORPORATION

  公开号：US20160122269A1

  公开（公告）日：2016-05-05

  There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.
• US5235113A
  申请人：——

  公开号：US5235113A

  公开（公告）日：1993-08-10
• US5391801A
  申请人：——

  公开号：US5391801A

  公开（公告）日：1995-02-21
• US5633418A
  申请人：——

  公开号：US5633418A

  公开（公告）日：1997-05-27