(((2-methyl-1,4-phenylene)bis(oxy))bis(carbonyl))bis(4,1-phenylene) bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate)

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并呋喃
• 英文名称: (((2-methyl-1,4-phenylene)bis(oxy))bis(carbonyl))bis(4,1-phenylene) bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate)
• 英文别名: [4-(1,3-Dioxo-2-benzofuran-5-carbonyl)oxy-3-methylphenyl] 1,3-dioxo-2-benzofuran-5-carboxylate；[4-(1,3-dioxo-2-benzofuran-5-carbonyl)oxy-3-methylphenyl] 1,3-dioxo-2-benzofuran-5-carboxylate
• 化学式: C₂₅H₁₂O₁₀
• 分子量: 472.364
• InChiKey: MXTIUKNCEVOAEU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.8
• 重原子数：
  35
• 可旋转键数：
  6
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  139
• 氢给体数：
  0
• 氢受体数：
  10

反应信息

• 作为产物：
  描述：

  甲基氢醌 、 氯化偏苯三酸酐 在 吡啶 作用下， 以 四氢呋喃 为溶剂， 生成 (((2-methyl-1,4-phenylene)bis(oxy))bis(carbonyl))bis(4,1-phenylene) bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate)
  参考文献：
  名称：

  具有低热膨胀系数的光学透明的芳族聚（酯酰亚胺）（1）。溶液浇铸过程中的自取向行为和​​取代效应

  摘要：

  由偏苯三酸酐氯化物和对苯二酚（HQ）类似物（包括各种烷基取代基）合成了一系列酯连接的四羧酸二酐。研究了由四羧酸二酐和2,2'-双（三氟甲基）联苯胺（TFMB）制备的芳族聚（酯酰亚胺）（PEsI）的性能，将其用作图像显示设备中的新型塑料基材。来自三甲基取代的HQ的化学酰亚胺化的PEsI甚至可溶于吸湿性较低的溶剂（例如环戊酮（CPN））中。从CPN解决方案进行简单浇铸可提供柔性且着色较少的薄膜，其热膨胀系数非常低（CTE = 11.5 ppm K -1），T g高276℃的热稳定性，高的热稳定性（在N 2中为5％的失重温度：453℃）和非常低的吸水率（W A  ＝ 0.13％）。较低的CTE是由沿X - Y方向高度对齐的主链造成的，这是在将PEsI溶液涂覆在基材上后溶剂蒸发过程中发生的。在这项工作中还提出了一种针对这种自我取向行为的机制。另一方面，热酰亚胺化的产品在低CTE和高透明度方面毫无价

  DOI：

  10.1016/j.polymer.2015.07.026

文献信息

• TW2019/36593
  申请人：——

  公开号：——

  公开（公告）日：——
• NOVEL ESTER GROUP-CONTAINING TETRACARBOXYLIC ACID DIANHYDRIDE, NOVEL POLYESTERIMIDE PRECURSOR DERIVED THEREFROM, AND POLYESTERIMIDE
  申请人：Hasegawa Masatoshi

  公开号：US20090306329A1

  公开（公告）日：2009-12-10

  Provided are a polyimide that demonstrates low coefficient of hygroscopic expansion and low water absorption coefficient when used as an insulation film, as well as an ester group-containing tetracarboxylic acid dianhydride expressed by the general formula below, and a novel polyesterimide precursor derived therefrom and polyesterimide, for use in the production of such polyimide: In the formula, each R is independent and represents a straight or branched-chain alkyl group with 1 to 6 carbon atoms or straight or branched-chain alkoxyl group with 1 to 6 carbon atoms, n is an integer of 0 to 4, and m is an integer of 2 to 4, with the proviso that if m=2, n is an integer of 1 to 4.
• ESTER GROUP-CONTAINING TETRACARBOXYLIC ACID DIANHYDRIDE, POLYESTER POLYIMIDE PRECURSOR, POLYESTERIMIDE, AND METHODS FOR PRODUCING SAME
  申请人：Hasegawa Masatoshi

  公开号：US20120029164A1

  公开（公告）日：2012-02-02

  Disclosed is a polyesterimide having a repeating unit expressed by the formula below, and also provides the manufacturing methods thereof: wherein R represents a phenyl group, R 1 represents an alkyl group with 1 to 6 carbon atoms or alkoxy group with 1 to 6 carbon atoms, n each independently takes a value of 0 to 4, a each independently takes a value of 0 to 4, and m represents an integer of 2 to 4, where not all n's are 0 at the same time and 0≦n+a≦4 is satisfied by each phenylene group, and X is a divalent aromatic group and/or aliphatic group.
• POLYAMIC ACID, POLYIMIDE, AND METHOD FOR MANUFACTURING GRAPHITE SHEET
  申请人：INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

  公开号：US20150130098A1

  公开（公告）日：2015-05-14

  Disclosed is a method of fabricating a graphite sheet, including: polymerizing diamines and a dianhydride to form a polyamic acid. The polyamic acid is solvent casted on a substrate and hot baked to form a polyamic acid film or gel film. The polyamic acid film or gel film is biaxially stretched at a high temperature imidization or chemical imidization to form the polyimide film. The polyimide film is then carbonized and graphitized to form a graphite sheet. The diamines include a diamine of Formula 1 and a diamine of Formula 2, and the dianhydride includes a dianhydride of Formulae 3, Formula 4, Formula 5, Formula 6, Formula 7, Formula 8, Formula 9, or combinations thereof.
• DIELECTRIC MATERIALS
  申请人：MERCK PATENT GMBH

  公开号：US20210062091A1

  公开（公告）日：2021-03-04

  The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.