Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 µm. R1 and R2 in the formula (1-1) each independently represent any group of the following formulae (i) to (iv), R1 and R2 in the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided.
本发明公开了一种含有下式(1-1)所代表结构单元的聚
酰亚胺树脂,以及一种含有下式(1-2)所代表结构单元且厚度为 10 至 50 微米的聚
酰亚胺薄膜。式(1-1)中的R1和R2各自独立地代表下式(i)至(iv)中的任何一个基团,式(1-2)中的R1和R2各自独立地代表下式(i)或式(ii)中的一个基团,在这些式中,*与式(1-1)和式(1-2)中带有*的碳键合,**与式(1-1)和式(1-2)中带有**的碳键合。本发明提供了一种聚
酰亚胺树脂,可形成透明度优异且线性热膨胀系数较低的聚
酰亚胺薄膜,以及一种线性热膨胀系数较低的聚
酰亚胺薄膜。