Photosensitive resin composition and photosensitive resin laminated film containing the same
申请人:TOKYO OHKA KOGYO CO., LTD.
公开号:EP0770923A1
公开(公告)日:1997-05-02
A photosensitive resin composition comprising the following components (A), (B) and (C): (A) a photopolymerizable urethane (meth)acrylate compound containing at least two acryloyl or methacryloyl groups, (B) an alkali-soluble polymer compound having an acid value of from 50 to 250 mgKOH/g, and (C) a photopolymerization initiator, wherein the photosensitive resin composition has an electrical insulation resistance of 8.0×109 to 1.0×1014 Ω·cm after photocuring. A photosensitive resin laminated film comprising a flexible film, a photosensitive layer provided on the flexible film, and a releasable film layer provided on the photosensitive layer, wherein the photosensitive layer comprises the above photosensitive resin composition.
一种光敏树脂组合物,包括下列组分(A)、(B)和(C):(A)可光聚合的氨基甲酸酯(甲基)丙烯酸酯化合物,其中至少含有两个丙烯酰基或甲基丙烯酰基;(B)碱溶性聚合物化合物,其酸值为50至250mgKOH/g;(C)光聚合引发剂,其中光敏树脂组合物在光固化后的绝缘电阻为8.0×109至1.0×1014Ω-cm。一种光敏树脂层压薄膜,包括柔性薄膜、设置在柔性薄膜上的光敏层和设置在光敏层上的可释放薄膜层,其中光敏层包括上述光敏树脂组合物。