A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:
一种可治愈的有机聚
硅氧烷组合物、封装剂和电子设备,该组合物包括至少一种
化学式1所代表的化合物,其具有小于约4,000的数量平均分子量,至少一种第一
硅氧烷化合物,包括
硅键氢;以及至少一种第二
硅氧烷化合物,包括
硅键烯基基团。