This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.
本发明提供了一种在阻燃性、绝缘性和粘合性方面都非常出色,并且在燃烧时不会产生有害物质的多层电路板,以及一种适用于获得多层电路板的固化组合物。该固化组合物含有绝缘
树脂(如脂环烯烃聚合物或芳香族聚醚聚合物)、氮型固化剂(如 1,3-
二烯丙基-5-
缩水甘油异
氰尿酸酯)和
磷型阻燃剂(如
磷酸酯酰胺),并通过溶液浇铸法成型为薄膜。将形成的薄膜层压在内层板上,然后固化,得到多层电路基板。