Provided is a plasma enhanced atomic layer deposition (PEALD) process for depositing etch-resistant SiOCN films. These films provide improved growth rate, improved step coverage and excellent etch resistance to wet etchants and post-deposition plasma treatments containing O
2
and NH
3
co-reactants. This PEALD process relies on one or more precursors reacting in tandem with the plasma exposure to deposit the etch-resistant thin-films of SiOCN. The films display excellent resistance to wet etching with dilute aqueous HF solutions, both after deposition and after post-deposition plasma treatment(s). Accordingly, these films are expected to display excellent stability towards post-deposition fabrication steps utilized during device manufacturing and build.
提供的是一种等离子增强原子层沉积(
PEALD)工艺,用于沉积耐刻蚀的SiOCN薄膜。这些薄膜提供了改善的生长速率、改善的阶梯覆盖和优异的耐湿法刻蚀和含O2和NH3共反应剂的沉积后等离子体处理的刻蚀抗性。这种
PEALD工艺依靠一个或多个前体与等离子体曝光同时反应,沉积SiOCN的耐刻蚀薄膜。这些薄膜在沉积后和沉积后等离子体处理后均表现出对稀释
水HF溶液的优异耐湿法蚀刻性能。因此,这些薄膜预计在器件制造和构建过程中显示出优异的稳定性。