Composition for forming insulating layer and insulating film
申请人:Kondo Fumitaka
公开号:US20070213502A1
公开(公告)日:2007-09-13
Such a composition for forming an insulating layer improved in insulating property is to be obtained. A composition for forming an insulating layer of an electronic device is provided, and the composition contains at least one polymer selected from a polyamic acid and a derivative of a polyamic acid, and a compound having a functional group capable of reacting with a carboxyl group contained in a constitutional unit of the polymer.