2,3,5,6-tetrakishydroxymethylbenzene-1,4-diol | 42934-02-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 酚类
• 英文名称: 2,3,5,6-tetrakishydroxymethylbenzene-1,4-diol
• 英文别名: 2,3,5,6-tetrakis-hydroxymethyl-hydroquinone；3,6-Dihydroxy-1,2,4,5-tetrakis-hydroxymethyl-benzol；2,3,5,6-Tetrakis-hydroxymethyl-hydrochinon；Tetrahydroxymethyl-1,4-dihydroxy-benzol；2,3,5,6-Tetrakis(hydroxymethyl)benzene-1,4-diol
• CAS: 42934-02-1
• 化学式: C₁₀H₁₄O₆
• 分子量: 230.218
• InChiKey: KDFWZNJXMYHVMF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1.2
• 重原子数：
  16
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  121
• 氢给体数：
  6
• 氢受体数：
  6

反应信息

• 作为反应物：
  描述：

  2,3,5,6-tetrakishydroxymethylbenzene-1,4-diol 在 盐酸 作用下， 生成 2,3,5,6-tetrakis-(2-hydroxy-5-methyl-benzyl)-hydroquinone
  参考文献：
  名称：

  �ber Phenolalkohole

  摘要：

  DOI：

  10.1007/bf00899429
• 作为产物：
  描述：

  聚合甲醛 、 对苯二酚 在 sodium hydroxide 作用下， 生成 2,3,5,6-tetrakishydroxymethylbenzene-1,4-diol
  参考文献：
  名称：

  v. Euler; Adler; Gie, Arkiv foer Kemi, 1940, vol. 14 B, # 9, p. 3,6

  摘要：

  DOI：

文献信息

• Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US10017664B2

  公开（公告）日：2018-07-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  用于形成具有高干法蚀刻抗性、抗扭曲性并具有良好的平整性和嵌入性能的抗蚀底层膜形成组合物，包括通过使含有芳香环的有机化合物A和至少具有两个含酚羟基的芳香烃环团的醛B反应而获得的树脂，并具有芳香烃环团通过三级碳原子键合的结构。醛B可以是化合物的化学式（1）： 所得的树脂可能具有化学式（2）的单元结构： Ar1和Ar2各自是C6-40芳基团。含有芳香环的有机化合物A可能是芳香胺或含酚羟基的化合物。该组合物可能进一步含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成抗蚀图案，包括通过将抗蚀底层膜形成组合物涂覆在半导体衬底上并对其进行烘烤来形成抗蚀底层膜。
• 방향족 하이드록시기를 포함하는 화합물, 이를 포함하는 광경화성 수지 조성물
  申请人：DONGWOO FINE-CHEM CO., LTD. 동우 화인켐 주식회사(119990493297) Corp. No ▼ 214911-0005738BRN ▼125-85-13136

  公开号：KR20150028686A

  公开（公告）日：2015-03-16

  본 발명은 방향족 하이드록시기를 포함하는 신규한 화합물 및 광경화성 화합물, 광 개시제 및 용제를 포함하는 광경화성 수지 조성물에 있어서, 상기 광경화성 화합물은 1개 이상의 방향족 하이드록시기 및 2개 이상의 광경화성 비닐기를 포함하는 화합물을 포함하는 것을 특징으로 하는 광경화성 수지 조성물에 관한 것이다.

  该专利涉及一种包含芳香羟基的新化合物以及包含光固化性化合物、光引发剂和溶剂的光固化性树脂组合物，在所述光固化性化合物中包含至少一个芳香羟基和至少两个光固化性乙烯基的化合物的光固化性树脂组合物。
• SILOXANE-BASED RESIN COMPOSITION
  申请人：Suwa Mitsuhito

  公开号：US20100316953A1

  公开（公告）日：2010-12-16

  The present invention is a siloxane-based resin composition including a siloxane-based resin and an imidosilane compound having a specific structure. Moreover, the present invention is a siloxane-based resin composition including a siloxane-based resin which is a reactive product to be obtained by hydrolyzing an alkoxysilane compound and an imidosilane compound having a specific structure and then making the resulting hydrolysate undergo a condensation reaction. According to the present invention, it is possible to form a cured film excellent in adhesion.

  本发明是一种基于硅氧烷的树脂组合物，包括一种基于硅氧烷的树脂和一种具有特定结构的亚氨基硅烷化合物。此外，本发明还是一种基于硅氧烷的树脂组合物，包括一种基于硅氧烷的树脂，该树脂是通过水解烷氧基硅烷化合物和具有特定结构的亚氨基硅烷化合物反应产生的反应产物，然后使所得到的水解产物经历缩合反应而得到的。根据本发明，可以形成具有优异附着力的固化膜。
• NOVOLAC RESIN-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION USING BISPHENOL ALDEHYDE
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20160068709A1

  公开（公告）日：2016-03-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar 1 and Ar 2 each are C 6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  高干法蚀刻抗性、抗扭曲性、并对不平整部分表现出良好的平整和嵌入性的抗阻层薄膜形成组合物，包括通过反应含芳香环的有机化合物A和至少有两个芳香族碳环环团且具有酚羟基的醛B所获得的树脂，并具有芳香族碳环环团通过三级碳原子键合的结构。醛B可以是化合物式（1）的化合物：所获得的树脂可以具有式（2）的单元结构：其中Ar1和Ar2各自是C6-40芳基团。含芳香环的有机化合物A可以是芳香胺或含酚羟基的化合物。该组合物还可以含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成光刻图形，包括将抗阻层薄膜形成组合物涂覆在半导体基板上并烘烤以形成抗阻层薄膜。
• A process for preparing a branched novolac
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0147538A1

  公开（公告）日：1985-07-10

  Large-scale preparation of branched novolacs by the acid catalyzed, exothermic condensation of methylol-reactive phenols with polymethylol diphenols is made practical by first carrying out the reaction on a scale which permits temperature control simply by cooling and then separately adding more of the premixed reactants and the catalyst at rates such that the temperature of the reaction mixture can readily be controlled.

  通过酸催化甲醇反应酚与聚甲醇二酚的放热缩合反应大规模制备支链酚醛树脂是可行的，方法是首先在一定规模上进行反应，只需通过冷却即可控制温度，然后以易于控制反应混合物温度的速率分别加入更多的预混合反应物和催化剂。