Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate
申请人:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
公开号:US11242425B2
公开(公告)日:2022-02-08
A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group.
In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
本发明提供了一种树脂组合物,其中包含分子中至少含有一个下式 (1) 所代表基团的化合物 (A)、交联型固化剂 (B) 以及分子中含有偶氮基团且除构成偶氮基团的氮原子外没有杂原子的偶氮化合物 (C)。
式(1)中,n 代表 0 至 10,Z 代表芳烯基,R1 至 R3 各自独立地代表氢原子或烷基。