MATERIAL FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20210181637A1
公开(公告)日:2021-06-17
The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent, where X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 1 to 10, and R
1
represents at least one or more of the following general formulae (2) to (4). This aims to provide an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.
本发明提供了一种用于形成有机薄膜的材料,包含以下通用式(1)所示的化合物和有机溶剂,其中X代表具有n1价的有机基团,具有2至50个碳原子,n1代表1至10的整数,R1代表至少一个或更多以下通用式(2)至(4)中的一种。这旨在提供一种用于形成具有高填充性、高平整性和对基底具有优异粘附力的有机薄膜的有机薄膜材料。