A material containing, as a main component, an organic silicon compound represented by the following general formula:
R
1
x
Si(OR
2
)
4-x
(where R
1
is a phenyl group or a vinyl group; R
2
is an alkyl group; and x is an integer of 1 to 3) is caused to undergo plasma polymerization or react with an oxidizing agent to form an interlayer insulating film composed of a silicon oxide film containing an organic component. As the organic silicon compound where R
1
is a phenyl group, there can be listed phenyltrimethoxysilane or diphenyldimethoxysilane. As the organic silicon compound where R
1
is a vinyl group, there can be listed vinyltrimethoxysilane or divinyldimethoxysilane.
一种材料,其主要成分是由以下通式表示的
有机硅化合物:
R
1
x
Si(OR
2
)
4-x
(其中 R
1
是苯基或
乙烯基;R
2
为烷基;x 为 1 至 3 的整数)进行等离子聚合或与氧化剂反应,形成由含有有机成分的氧化
硅膜构成的层间绝缘膜。作为
有机硅化合物,其中 R
1
为苯基的
有机硅化合物,可以列出苯基
三甲氧基硅烷或二苯基二甲氧基
硅烷。作为 R
1
为
乙烯基的
有机硅化合物,可列出
乙烯基三甲氧基硅烷或二
乙烯基二甲氧基
硅烷。