申请人:Toyo Boseki Kabushiki Kaisha
公开号:EP0470636A1
公开(公告)日:1992-02-12
A photosensitive resin composition which is excellent in flexibility and impact resilience, which is less affected by humidity is provided. This composition comprises a soluble synthetic polymer, a photopolymerizable unsaturated compound, and a photo-polymerization initiator, wherein the soluble synthetic polymer comprises an addition polymer obtained by the reaction between a diamine compound having amino groups selected from primary and secondary amino groups and having no amide bonds in its molecule and a diisocyanate compound; and the addition polymer contains a polyoxyalkylene glycol component in an amount of 20 to 80% by weight.
本发明提供了一种柔韧性和抗冲击性极佳且受湿度影响较小的光敏树脂组合物。这种组合物由可溶性合成聚合物、可光聚合的不饱和化合物和光聚合引发剂组成,其中可溶性合成聚合物包括由具有选自伯氨基和仲氨基的氨基且分子中没有酰胺键的二胺化合物与二异氰酸酯化合物反应得到的加成聚合物;加成聚合物中含有聚氧亚烷基二醇成分,其含量为 20% 至 80%(按重量计)。