申请人:HAEGER Harald
公开号:US20130240799A1
公开(公告)日:2013-09-19
A polyamide composition which provides moldings having a significantly reduced percolation threshold and an improved electrical conductivity is provided. The composition contains a) at least 40 parts by weight of a polyamide; b) from 0.15 to 25 parts by weight of an electrically conductive carbon; c) from 0.3 to 8 parts by weight of an oligofunctional compound; and, optionally, d) conventional auxiliaries and additives, wherein the electrically conductive carbon comprises at least one of carbon nanotubes and graphene, the oligofunctional compound comprises at least one functional group reactive with reactive groups on a surface of the electrically conductive carbon and at least one functional group reactive with an end group of the polyamide, and the sum of the parts by weight of the components a) to d) is 100.
提供了一种聚酰胺组合物,可提供具有显著降低渗透阈值和改善电导率的模塑件。该组合物包含a)至少40份重量的聚酰胺;b)0.15至25份重量的导电碳;c)0.3至8份重量的寡功能化合物;以及可选的d)传统辅助剂和添加剂,其中导电碳包括碳纳米管和石墨烯中的至少一种,寡功能化合物包括至少一种与导电碳表面上的反应性基团反应的功能性基团和至少一种与聚酰胺末端基团反应的功能性基团,组分a)到d)的重量份之和为100。