Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
申请人:SUMITOMO METAL MINING CO., LTD.
公开号:US10654101B2
公开(公告)日:2020-05-19
Provided is a silver-coated copper powder which can be utilized as an electrically conductive paste and an electromagnetic wave shield. A silver-coated copper powder has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 μm to 5.0 μm to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 μm to 100 μm, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.
本发明提供了一种可用作导电浆料和电磁波屏蔽层的镀银铜粉。镀银铜粉呈树枝状,具有线状生长的主茎和从主茎分离出来的多个分支,主茎和分支构成平板状铜颗粒,其横截面平均厚度为 0.02 μm 至 5.0 μm,由扫描电子显微镜(SEM)观察聚集确定,铜颗粒表面镀有银,镀银铜粉 1 的平均颗粒直径(D50)为 1.0 μm 至 100 μm,相对于铜颗粒的平板形表面的垂直方向上的最大高度为铜颗粒的平板形表面的水平方向上的最大长度的 1/10 或以下。