N,N''-Diphenyltriimidodicarbonic diamide | 47016-72-8

• 分子结构分类: 有机化合物 - 有机氮化合物
• 英文名称: N,N''-Diphenyltriimidodicarbonic diamide
• 英文别名: 1-carbamimidoyl-1,2-diphenylguanidine
• CAS: 47016-72-8
• 化学式: C₁₄H₁₅N₅
• 分子量: 253.3
• InChiKey: QILCIOGHZFYQEQ-UHFFFAOYSA-N

物化性质

• 熔点：
  145-146 °C
• 沸点：
  365.1±25.0 °C(Predicted)
• 密度：
  1.21±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  91.5
• 氢给体数：
  3
• 氢受体数：
  2

文献信息

• CURABLE COMPOSITION AND CURED MATERIAL
  申请人：Kaneka Corporation

  公开号：EP2267083A1

  公开（公告）日：2010-12-29

  An object of the present invention is to provide a curable composition which is excellent in curability and storage stability without an organotin curing catalyst which is known to be toxic. In order to achieve this object, the present inventors have studied to find that a curable composition comprising: (A) an organic polymer having a silicon-containing group cross-linkable by siloxane bond formation (reactive silyl group); (B) a guanidine compound; and (C) a methyl ester group-containing compound is effective. In addition, the present inventors have found that a cured product of this curable composition has good physical properties. Thereby, the present inventors have completed the present invention.

  本发明的目的是提供一种固化组合物，该组合物不使用已知有毒的有机锡固化催化剂，而具有极佳的固化性和贮存稳定性。为了实现这一目标，本发明者经过研究发现，一种包含以下成分的可固化组合物是有效的：(A) 具有可通过硅氧烷键形成交联的含硅基团（活性硅基）的有机聚合物；(B) 一种胍类化合物；(C) 一种含甲酯基团的化合物。此外，本发明者还发现这种可固化组合物的固化产品具有良好的物理性能。因此，本发明者完成了本发明。
• CURABLE COMPOSITION AND CURED PRODUCT THEREOF
  申请人：Kaneka Corporation

  公开号：EP2338938A1

  公开（公告）日：2011-06-29

  The present invention aims to provide a curable composition without adverse effects on the environment, which exhibits excellent curability without containing a toxic organotin curing catalyst, and gives a cured product that does not have discoloration and cracks on the surface thereof even after being exposed to the atmosphere and ultraviolet light for a long time. The present invention also aims to provide the cured product. The curable composition comprises: (A) an organic polymer having a reactive silyl group; (B) a guanidine compound having a specific structure; and (C) a phosphorus compound that has an aryl group, has a phosphorus atom with an oxi.dation number of +5, and has a melting point of 23°C or higher.

  本发明的目的是提供一种对环境无不良影响的固化组合物，该组合物不含有毒的有机锡固化催化剂，具有优异的固化性能，即使长期暴露在大气和紫外线下，其表面也不会出现变色和裂纹。本发明还旨在提供固化产品。固化组合物包括：(A) 具有活性硅基的有机聚合物；(B) 具有特定结构的胍化合物；(C) 具有芳基、磷原子的阳离子数为 +5、熔点为 23℃或更高的磷化合物。
• CURABLE COMPOSITION, AND CURED SYNTHETIC RESIN USING SAME
  申请人：Mie University

  公开号：EP2837660A1

  公开（公告）日：2015-02-18

  [Problem] To provide a curable composition having high stability and excellent curing properties. [Solution] The present invention relates to a curable composition, and a cured synthetic resin using same, that functions as a curing catalyst for a synthetic resin. The curable composition contains (A) a titanium alkoxide, (B) a bidentate organic chelating agent that stabilizes the titanium alkoxide and (C) a guanidine compound. The molar ratio of the titanium alkoxide (A), the bidentate organic chelating agent (B), and the guanidine compound (C) is 1:0.5-3:0.5-2.

  [问题]提供一种具有高稳定性和优异固化性能的固化组合物。 [解决方案] 本发明涉及一种可固化组合物和使用该组合物固化的合成树脂，该组合物可用作合成树脂的固化催化剂。固化组合物包含（A）氧化钛，（B）稳定氧化钛的双齿有机螯合剂和（C）胍类化合物。氧化钛（A）、双叉有机螯合剂（B）和胍化合物（C）的摩尔比为 1:0.5-3:0.5-2。
• Curable organopolysiloxane compositions
  申请人：Wacker Chemie AG

  公开号：US10301433B2

  公开（公告）日：2019-05-28

  Artificial stone having excellent mechanical and weatherability properties is prepared from a highly filled crosslinkable organosilicon composition where the filler comprises at least 20 weight percent of coarse fillers, the organosilicon component contains silicon-bonded alkoxy and or hydroxyl groups, with a catalyst containing a metal compound and an amidine or guanidine.

  具有优异机械性能和耐候性能的人造石是由一种高填充可交联有机硅组合物制备而成的，其中填料包括至少 20 重量百分比的粗填料，有机硅组分含有硅键合烷氧基和或羟基，催化剂含有金属化合物和脒或胍。
• CURABLE COMPOSITION AND CURED OBJECT FORMED THEREFROM
  申请人：KANEKA CORPORATION

  公开号：EP2388297B1

  公开（公告）日：2020-08-19