PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
申请人:ASAHI KASEI E-MATERIALS CORPORATION
公开号:US20140349222A1
公开(公告)日:2014-11-27
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R
1
to R
7
, m
1
to m
4
, n
1
, n
2
, Y and W are each as defined in the description.