1,2-Bis-(4-hydroxy-3,5-dimethyl-phenyl)-ethen | 31758-94-8

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二苯乙烯类
• 英文名称: 1,2-Bis-(4-hydroxy-3,5-dimethyl-phenyl)-ethen
• 英文别名: 3,5,3',5'-tetramethyl-trans-stilbene-4,4'-diol；3,5,3',5'-Tetramethyl-trans-stilben-4,4'-diol；(e)-4,4'-(Ethene-1,2-diyl)bis(2,6-dimethylphenol)；4-[(E)-2-(4-hydroxy-3,5-dimethylphenyl)ethenyl]-2,6-dimethylphenol
• CAS: 31758-94-8
• 化学式: C₁₈H₂₀O₂
• 分子量: 268.356
• InChiKey: WTWMJYNGYCJIGR-AATRIKPKSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.9
• 重原子数：
  20
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.22
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  alkaline earth salt of/the/ methylsulfuric acid 在 溶剂黄146 、 锌 作用下， 生成 1,2-Bis-(4-hydroxy-3,5-dimethyl-phenyl)-ethen
  参考文献：
  名称：

  87.用过氧化苯甲酰氧化苯酚。第二部分

  摘要：

  DOI：

  10.1039/jr9510000388

文献信息

• Curable mixture of mesogenic epoxy resins and mesogenic polyamines and cured compositions
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0473935A2

  公开（公告）日：1992-03-11

  Compositions comprising epoxy resins containing one or more mesogenic or rodlike moieties per molecule are cured with polyamines containing one or more mesogenic or rodlike moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any mesogenic or rodlike moieties.

  由分子中含有一个或多个介基或棒状分子的环氧树脂组成的组合物与分子中含有一个或多个介基或棒状分子的多胺一起固化。在固化前和/或固化过程中，可通过施加电场或磁场或拉伸和/或剪切流使这些固化组合物定向。与不含任何介基或棒状基团的同类环氧树脂体系相比，固化后的产品在一种或多种物理和/或机械和/或热性能方面均有改善。
• Epoxy resin composition and method for producing the same
  申请人：Sumitomo Chemical Company, Limited

  公开号：EP0869148A1

  公开（公告）日：1998-10-07

  Provided is an epoxy resin composition comprising a crystalline epoxy resin (A) and an amorphous epoxy resin as an essential component, wherein the crystalline epoxy resin (A) being uniformly dispersed in the amorphous epoxy resin (B) as a crystallite. The epoxy resin composition has a high softening point, hardly causes blocking during the storage and has an excellent handling property.

  本发明提供了一种环氧树脂组合物，该组合物由结晶环氧树脂（A）和作为基本成分的无定形环氧树脂组成，其中结晶环氧树脂（A）作为结晶体均匀地分散在无定形环氧树脂（B）中。这种环氧树脂组合物具有较高的软化点，在贮存过程中几乎不会产生堵塞，并且具有极佳的处理性能。
• EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1130041A1

  公开（公告）日：2001-09-05

  The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.

  本发明提供了一种环氧树脂组合物，该组合物具有快速固化性和优异的储存稳定性，可用于电子和电气材料领域。也就是说，本发明是一种环氧树脂组合物，包括分子中含有两个或两个以上环氧基团的化合物（A）、分子中含有两个或两个以上酚羟基的共缩合产物（B）和四取代膦（X）的分子缔合产物（C）、分子中含有两个或两个以上酚羟基的化合物（Y），以及分子中含有两个或两个以上酚羟基的化合物（Y）的共轭碱，所述共轭碱是通过从分子中含有两个或两个以上酚羟基的上述化合物（Y）中移除一个氢原子而获得的氧化酚型化合物。
• Electronic packaging
  申请人：Evonik Degussa GmbH

  公开号：EP2119737A1

  公开（公告）日：2009-11-18

  Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1) : wherein R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstitued phenyl group or a halogen atom, (B) a polyfunctional epoxy compound having a functional group number of two or more, and (C) an epoxy curing agent containing a phenolic hydroxyl group, wherein the proportion of the epoxy compound (A) is from 1 to 99 % by weight based on the total weight of the epoxy compounds (A) and (B), whereas the epoxy resin composition contains a pyrogenically produced silica, which has been surface modified with Hexamethyldisilazane (HMDS) and structurally modified by a ball mill.

  提供了一种环氧树脂组合物，其中包括 (A) 由通式(1)代表的环氧化合物 ： 其中 R1 至 R9 各自独立地代表氢原子、具有 1 至 6 个碳原子的无环或环状烷基、取代或未取代的苯基或卤素原子、 (B) 具有两个或更多官能团的多官能环氧化合物，以及 (C) 含有酚羟基的环氧固化剂、 其中环氧化合物(A)的比例为 1%至 99%（以环氧化合物(A)和(B)的总重量为基准），而环氧树脂组合物中含有热法制得的二氧化硅，该二氧化硅已用六甲基二硅氮烷（HMDS）进行表面改性，并用球磨机进行结构改性。
• Semiconductor device encapsulated with epoxy resin composition comprising latent catalyst
  申请人：——

  公开号：US20010021454A1

  公开（公告）日：2001-09-13

  This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

  本发明提供了一种具有硼酸鏻结构的潜催化剂，该结构由四个特定基团与磷原子键合的一价阳离子部分和四个特定基团与硼原子键合的一价阴离子部分组成；本发明还提供了一种具有上述硼酸鏻为循环单元且至少两个所述循环单元通过至少一个与硼原子键合的四个特定基团连接的结构的潜催化剂。本发明还提供了一种包含这种潜伏催化剂的热固性树脂组合物和一种包含这种潜伏催化剂的环氧树脂成型材料，并进一步提供了一种半导体器件，在该半导体器件中，半导体被所述环氧树脂成型材料封装。