Cobalt‐Catalyzed Electroreductive Alkylation of Unactivated Alkyl Chlorides with Conjugated Olefins
作者:Samir Al Zubaydi、Immaculata O. Onuigbo、Blaise L. Truesdell、Christo S. Sevov
DOI:10.1002/anie.202313830
日期:2024.1.2
A mild electrocatalytic system is reported for the reductive alkylation of primary, secondary, or tertiary alkyl chlorides with conjugated alkenes.
据报道,温和的电催化系统可用于伯、仲或叔烷基氯与共轭烯烃的还原烷基化。
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
申请人:FUJIMI INCORPORATED
公开号:EP2237311A1
公开(公告)日:2010-10-06
A polishing composition according to a first aspect of the present invention contains a nitrogen-containing compound and abrasive grains, and the pH of the composition is in the range of 1 to 7. The nitrogen-containing compound in the polishing composition preferably has a structure expressed by a formula: R1-N(-R2)-R3 in which R1, R2, and R3 each represent an alkyl group with or without a characteristic group, two of R1 to R3 may form a part of a heterocycle, and two of R1 to R3 may be identical and form a part of a heterocycle with the remaining one, Alternatively, the nitrogen-containing compound is preferably selected from a group consisting of a carboxybetaine type ampholytic surfactant, a sulfobetaine type ampholytic surfactant, an imidazoline type ampholytic surfactant, and an amine oxide type ampholytic surfactant. A polishing composition according to a second aspect of the present invention contains a water-soluble polymer and abrasive grains, and the pH of the composition is in the range of 1 to 8.
Polishing composition and polishing method using the same
申请人:Mizuno Takahiro
公开号:US10144849B2
公开(公告)日:2018-12-04
A polishing composition contains a nitrogen-containing compound and abrasive grains, and the pH of the composition is in the range of 1 to 7. The nitrogen-containing compound in the polishing composition preferably has a structure expressed by a formula: R1—N(—R2)—R3 in which R1, R2, and R3 each represent an alkyl group with or without a characteristic group, two of R1 to R3 may form a part of a heterocycle, and two of R1 to R3 may be identical and form a part of a heterocycle with the remaining one. Alternatively, the nitrogen-containing compound is preferably selected from a group consisting of a carboxybetaine type ampholytic surfactant, a sulfobetaine type ampholytic surfactant, an imidazoline type ampholytic surfactant, and an amine oxide type ampholytic surfactant. A polishing composition may contain a water-soluble polymer and abrasive grains, and the pH of the composition is in the range of 1 to 8.
Polishing Composition and Polishing Method Using the Same
申请人:Mizuno Takahiro
公开号:US20100301014A1
公开(公告)日:2010-12-02
A polishing composition contains a nitrogen-containing compound and abrasive grains, and the pH of the composition is in the range of 1 to 7. The nitrogen-containing compound in the polishing composition preferably has a structure expressed by a formula: R
1
—N(—R
2
)—R
3
in which R
1
, R
2
, and R
3
each represent an alkyl group with or without a characteristic group, two of R
1
to R
3
may form a part of a heterocycle, and two of R
1
to R
3
may be identical and form a part of a heterocycle with the remaining one. Alternatively, the nitrogen-containing compound is preferably selected from a group consisting of a carboxybetaine type ampholytic surfactant, a sulfobetaine type ampholytic surfactant, an imidazoline type ampholytic surfactant, and an amine oxide type ampholytic surfactant. A polishing composition may contain a water-soluble polymer and abrasive grains, and the pH of the composition is in the range of 1 to 8.