N'-[2-(2-aminoethylamino)ethyl]ethane-1,2-diamine;hydrofluoride | 68444-13-3

• 分子结构分类: 有机化合物 - 有机氮化合物
• 英文名称: N'-[2-(2-aminoethylamino)ethyl]ethane-1,2-diamine;hydrofluoride
• CAS: 68444-13-3
• 化学式: C6H19FN4
• 分子量: 166.24
• InChiKey: GBOWZAIOPGNBFT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1.76
• 重原子数：
  11
• 可旋转键数：
  7
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  76.1
• 氢给体数：
  5
• 氢受体数：
  5

文献信息

• SOLUTION FOR REMOVING RESIDUE AFTER SEMICONDUCTOR DRY PROCESS AND METHOD OF REMOVING THE RESIDUE USING THE SAME
  申请人：Nakamura Shingo

  公开号：US20100203735A1

  公开（公告）日：2010-08-12

  A residue-removing solution for removing residues present on semiconductor substrates after dry etching and/or ashing, the residue-removing solution comprising a Cu surface protective agent including: at least one compound selected from compounds (1), (2) and (3) each having as a basic skeleton a five-membered or six-membered heteratomic structure as defined herein; a compound capable of forming a complex or chelate with Cu (copper); and water. Further, the residue-removing solution has a pH of 4 to 9.
• SOLUTION FOR REMOVAL OF RESIDUE AFTER SEMICONDUCTOR DRY PROCESS AND RESIDUE REMOVAL METHOD USING SAME
  申请人：Nakamura Shingo

  公开号：US20110143547A1

  公开（公告）日：2011-06-16

  The present invention provides a chemical solution capable of completely removing the residues after a dry process in a short period of time, wherein the chemical solution causes less damage to low-k films than before, and prevents cracking and roughness of the Cu surface by inhibiting Cu corrosion so as to leave, rather than remove, a Cu thin film, which is formed on the Cu surface as a result of damage during a dry process. Specifically, the present invention relates to a residue-removing solution for removing residues after a dry process, comprising an amine salt of a monocarboxylic acid and/or a salt of a polycarboxylic acid that forms a 7- or more-membered ring chelate with copper, and water, the residue-removing solution comprising (A) or (B) described below: (A) an aqueous solution comprising (1) a Brønsted acid whose pKa is at least 3 at 25° C., (2) an amine salt of a monocarboxylic acid, and/or (3) at least one member selected from the group consisting of an ammonium salt, an amine salt, and a quaternary ammonium salt of a polycarboxylic acid that forms a 7- or more-membered ring chelate with copper, and (4) water, wherein the pH of the aqueous solution is equal to or less than the pKa of the monocarboxylic acid at 25° C., and the like. (B) an aqueous solution comprising (5) an amine salt of a monocarboxylic acid, and/or (6) an amine salt of a polycarboxylic acid that forms a 7- or more-membered ring chelate with copper, and (7) water, wherein the pH of the aqueous solution is equal to or greater than the pKa of the monocarboxylic acid at 25° C., and the like.
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  公开号：US8822396B2

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