The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.
本发明提供了一种
树脂浸渍材料和一种复合材料,它们同时具有优异的介电性能、高耐热性、低应力特性等,以及使用它们的覆
铜箔层压板。该
树脂浸渍材料是通过将多孔
氟树脂浸渍在含有以下成分的可固化
树脂组合物中形成的:(A) 由通式 (I) 表示的双马来
酰亚胺化合物;和 (B) 自由基聚合
引发剂。通式(I)中,X 代表主链上具有 10 至 30 个碳原子的脂族、脂环族或芳香族烃基;Y 代表脂族、脂环族或芳香族烃基;n 代表 1 至 20 范围内的数字。