(1) A cleaning solution for semiconductor substrates comprising an oxidizing agent, an acid and a fluorine compound, having a pH adjusted in the range of 3 to 10 by addition of a basic compound and having a concentration of water of 80% by weight or greater, (2) a cleaning solution for semiconductor substrates comprising an oxidizing agent, an acid, a fluorine compound and a corrosion inhibitor, having a pH adjusted in the range of 3 to 10 by addition of a basic compound and having a concentration of water of 80% by weight or greater, and a process for cleaning semiconductor substrates having metal wiring which comprises cleaning with the cleaning solution, are provided. The cleaning solution can completely remove residues of etching on semiconductor substrates in a short time, does not corrode copper wiring materials and insulation film materials, is safe and exhibits little adverse effects on the environment.
(1) 一种用于半导体基底的清洗液,包括一种氧化剂、一种酸和一种
氟化合物,其 pH 值通过添加一种碱性化合物在 3 至 10 的范围内进行调节,并且
水的浓度为 80% 或更高(按重量计);(2) 一种用于半导体基底的清洗液,包括一种氧化剂、一种酸、一种
氟化合物和一种缓蚀剂,其 pH 值通过添加一种碱性化合物在 3 至 10 的范围内进行调节,并且
水的浓度为 80% 或更高(按重量计);以及一种用于半导体基底的工艺、(2) 由氧化剂、酸、
氟化合物和腐蚀
抑制剂组成的半导体基板清洗液,其 pH 值通过添加碱性化合物在 3 至 10 的范围内调节,
水的浓度为 80% 或更高。该清洗液可在短时间内彻底清除半导体基片上的蚀刻残留物,不会腐蚀
铜配线材料和绝缘膜材料,安全且对环境的不利影响小。