Disclosed is a photocurable composition comprising; an epoxy compound having at least one epoxy group and at least one unsaturated double bond at the same time in the molecule; a metal compound formulated in an amount ranging from 0.001 to 10 wt.% based on the epoxy compound; and a silicon compound capable of forming a silanol group by irradiation of light and formulated in an amount ranging from 0.1 to 20 wt.% based on the epoxy compound.
本发明公开了一种光固化组合物,该组合物包括:分子中同时具有至少一个环氧基团和至少一个不饱和双键的环氧化合物;以环氧化合物为基础,配制成 0.001 至 10 wt.% 的
金属化合物;以及以环氧化合物为基础,配制成 0.1 至 20 wt.% 的可通过光照射形成
硅醇基团的
硅化合物。