N,N,N'-Trimethyl-N'-octadecyl-ethane-1,2-diamine | 102542-80-3

• 分子结构分类: 有机化合物 - 有机氮化合物
• 英文名称: N,N,N'-Trimethyl-N'-octadecyl-ethane-1,2-diamine
• 英文别名: N~1~,N~1~,N~2~-Trimethyl-N~2~-octadecylethane-1,2-diamine；N,N,N'-trimethyl-N'-octadecylethane-1,2-diamine
• CAS: 102542-80-3
• 化学式: C₂₃H₅₀N₂
• 分子量: 354.663
• InChiKey: SYDRZIVVHNHENB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  9.1
• 重原子数：
  25
• 可旋转键数：
  20
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  6.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• [EN] BISCATIONIC AND TRISCATIONIC AMPHILES AS ANTIMICROBIAL AGENTS<br/>[FR] COMPOSÉS AMPHIPHILES BISCATIONIQUES ET TRISCATIONIQUES UTILISÉS COMME AGENTS ANTIMICROBIENS
  申请人：UNIV TEMPLE

  公开号：WO2015069760A1

  公开（公告）日：2015-05-14

  The present disclosure provides an antimicrobial composition including a compound which is a biscationic or triscationic amphiphile, and the method of making such an antimicrobial composition, and the method of using such a compound or composition for antimicrobial use. The antimicrobial composition can include a compound having the formula (I) wherein R is a methylene group unsubstituted or optionally substituted, s is an integer in the range from 1 to 6, R1, R2, R3 or R4 is H or a C 1-4 alkyl unsubstituted or optionally substituted, X is a halogen, m and n are integers in the range from 5 to 25, and m is not equal to n. Alternatively, the antimicrobial composition can comprise a compound having the formula (III) or (IV) wherein R1, R2, R3, R4 R5, or R6 is H or a C1-4 alkyl unsubstituted or optionally substituted, X or Y is a halogen, and m and n are integers in the range from 5 to 25.

  本公开提供了一种抗微生物组合物，包括一种双阳离子或三阳离子两性分子，以及制备此类抗微生物组合物的方法，以及使用此类化合物或组合物进行抗微生物用途的方法。抗微生物组合物可以包括具有以下结构式(I)的化合物，其中R是未取代或可选择取代的亚甲基基团，s是在1到6范围内的整数，R1、R2、R3或R4是H或未取代或可选择取代的C1-4烷基，X是卤素，m和n是在5到25范围内的整数，且m不等于n。或者，抗微生物组合物可以包括具有以下结构式(III)或(IV)的化合物，其中R1、R2、R3、R4、R5或R6是H或未取代或可选择取代的C1-4烷基，X或Y是卤素，m和n是在5到25范围内的整数。
• Thermosetting resin composition containing malemide and/or vinyl compounds
  申请人：QUANTUM MATERIALS, INC.

  公开号：EP1344789A2

  公开（公告）日：2003-09-17

  The invention provides a thermosetting resin composition comprising: (a) a maleimide having the structure:    wherein: m = 1, 2 or 3, (b) in the range of about 0.01 up to about 10 equivalents of a vinyl compound per equivalent of maleimide,    wherein said vinyl compound has the structure:    wherein: q is 1, 2 or 3, and each Q is independently selected from -O-, -O-C(O)-, -C(O)- or -C(O)-O-, (c) in the range of 0.2 up to 3 wt % of at least one free radical initiator, based on the total weight of the composition.

  本发明提供了一种热固性树脂组合物，其中包括 (a) 具有以下结构的马来酰亚胺 其中 m = 1、2 或 3、 (b) 每当量马来酰亚胺中含有约 0.01 至约 10 个当量的乙烯基化合物、 其中所述乙烯基化合物具有以下结构 其中 q 是 1、2 或 3、 每个 Q 独立选自-O-、-O-C(O)-、-C(O)- 或-C(O)-O-、 (c) 基于组合物总重量，至少一种自由基引发剂的重量百分比为 0.2 至 3。
• Method for the preparation of bismaleimides
  申请人：Henkel Loctite Corporation

  公开号：EP1359144A1

  公开（公告）日：2003-11-05

  The invention provides a method for the preparation of bismaleimides from diamines, said method comprising: adding diamine to a solution of maleic anhydride, adding acetic anhydride to said solution once diamine addition is complete, and then allowing the resulting mixture to stir for at least 12 hours, and thereafter treating the result reaction mixture with a suitable isomerising agent.

  本发明提供了一种从二胺制备双马来酰亚胺的方法，所述方法包括 将二胺加入马来酸酐溶液中、 在二胺添加完成后，向所述溶液中添加乙酸酐，然后让所得混合物搅拌至少 12 小时，然后 用合适的异构化剂处理反应混合物。
• METHODS FOR REDUCING VOID FORMATION UPON CURING OF ADHESIVE FORMULATIONS AND COMPOSITIONS USEFUL THEREFOR
  申请人：——

  公开号：US20020062923A1

  公开（公告）日：2002-05-30

  In accordance with the present invention, adhesive formulations have been developed which enable curing of adhesively bonded assemblies (i.e., assemblies which comprise devices which have been adhesively bonded to substrates) with dramatically reduced occurrence of void formation upon curing. In many instances, void formation can be eliminated employing invention compositions. In accordance with another aspect of the present invention, methods employing the above-described adhesive formulations are also provided, as are substantially void-free articles produced thereby.

  根据本发明，已开发出粘合剂配方，可使粘合剂粘合的组件（即由已粘合到基底的装置组成的组件）在固化时显著减少空隙的形成。在许多情况下，使用本发明组合物可以消除空隙形成。根据本发明的另一个方面，还提供了采用上述粘合剂配方的方法，以及由此生产的基本上无空隙的制品。
• THERMOSETTING RESIN COMPOSITIONS CONTAINING MALEIMIDE AND/OR VINYL COMPOUNDS
  申请人：Henkel Corporation

  公开号：EP0778857B1

  公开（公告）日：2004-07-21