申请人:Université de Haute Alsace
公开号:EP3677612A1
公开(公告)日:2020-07-08
The present invention relates to a process for preparing polymer/opaque filler composite materials using a three-component copper complex/iodonium salt/amine as photoinitiating system, and uses of a copper complex and/or tri-association copper complex/iodonium salt/amine for effecting visible to middle-to-near UV free radical photopolymerization and/or cationic photopolymerization of a composition comprising a light-occulting amount of opaque fillers. The present invention also relates to uses of a copper complex and/or tri-association copper complex/iodonium salt/amine for preparing polymer/opaque filler composite materials wherein the polymer is an interpenetrated network. The present invention also relates to uses of a copper complex and/or tri-association copper complex/iodonium salt/amine for dark curing polymerizable compositions containing light-occulting amounts of opaque fillers, under visible to middle-to-near UV irradiation.
本发明涉及一种使用三组份铜络合物/碘鎓盐/胺作为光引发体系制备聚合物/不透明填料复合材料的工艺,以及铜络合物和/或三缔合铜络合物/碘鎓盐/胺的用途,该铜络合物和/或三缔合铜络合物/碘鎓盐/胺可实现可见光至中近紫外光自由基光聚合和/或阳离子光聚合,该组合物包含一定量的不透明填料。本发明还涉及铜络合物和/或三缔合铜络合物/碘鎓盐/胺用于制备聚合物/不透明填料复合材料的用途,其中聚合物为互穿网络。本发明还涉及铜络合物和/或三缔合铜络合物/碘鎓盐/胺在可见光至中近距离紫外线辐照下用于暗固化含有遮光量不透明填料的可聚合组合物的用途。