COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL
申请人:KAWANO Takatsugu
公开号:US20110104454A1
公开(公告)日:2011-05-05
The present invention provide a composition for forming a layer to be plated, including a solution in which from 1% by mass to 20% by mass of a polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, and a water-insoluble photopolymerization initiator are dissolved in a mixed solvent comprising from 20% by mass to 99% by mass of a water-soluble flammable liquid and water; a method of producing a metal pattern material using the composition for forming a layer to be plated; and a metal pattern material produced by the method.