2,3-Diphenyl-1,2-benzoxazine

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并恶嗪类
• 英文名称: 2,3-Diphenyl-1,2-benzoxazine
• 英文别名: 2,3-diphenyl-1,2-benzoxazine
• 化学式: C₂₀H₁₅NO
• 分子量: 285.3
• InChiKey: WZNAGBIVILNRTQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.7
• 重原子数：
  22
• 可旋转键数：
  2
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  12.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• HALOGEN-FREE RESIN COMPOSITION AND USE THEREOF
  申请人：Shengyi Technology Co. Ltd.

  公开号：EP3053963A1

  公开（公告）日：2016-08-10

  Disclosed is a halogen-free resin composition. The halogen-free resin composition comprises: (A) 10-60 parts by weight of dicyclopentadiene benzoxazine resin, (B) an epoxy resin, (C) an active ester curing agent and (D) a phosphorus-containing flame retardant, based on 100 parts by weight of the total amount of total organic solid matters of (A), (B), (C) and (D). A prepreg and a laminate which are prepared using the halogen-free resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

  公开了一种无卤素树脂组合物。无卤素树脂组合物包括：(A) 10-60 重量份的双环戊二烯苯并恶嗪树脂；(B) 环氧树脂；(C) 活性酯固化剂；(D) 含磷阻燃剂（以(A)、(B)、(C)和(D)中有机固体物质总量的 100 重量份为基准）。使用无卤树脂组合物制备的预浸料和层压板具有低介电常数、低介电损耗因子、低吸水性、高尺寸稳定性、高耐热性和良好的阻燃性、加工性和耐化学性。
• COATED ARTICLE COMPRISING A CURABLE COMPOSITION COMPRISING BIS-BENZOXAZINE AND AN AMINO-FUNCTIONALIZED TRIAZINE
  申请人：ZAHR GEORGE ELIAS

  公开号：US20140072800A1

  公开（公告）日：2014-03-13

  The present invention deals with a novel coated article comprising a substrate and a curable adhesive bonding layer in adhering contact with said substrate wherein said substrate is a polymeric sheet or film and said curable adhesive bonding layer comprises a curable composition comprising a bis-benzoxazine and an amino-functionalized triazine composition. The coated article hereof is useful in the manufacture of encapsulated printed wiring boards, especially flexible printed wiring boards.
• CURABLE COMPOSITION COMPRISING BIS-BENZOXAZINE, METHOD OF CURING, AND THE CURED COMPOSITION SO FORMED
  申请人：ZAHR GEORGE ELIAS

  公开号：US20140073736A1

  公开（公告）日：2014-03-13

  The present invention deals with a novel curable composition comprising bis-benzoxazine and an amine-functionalized triazine, especially a di-isoimide, and the use thereof in the preparation of encapsulated printed wiring boards, especially flexible printed wiring boards. The curable composition hereof beneficially effects crosslinking of bis-benzoxazine at a lower temperature than has heretofore been provided in the art.