[Ditert-butyl-hydroxy-[(4-hydroxyphenyl)methyl]-lambda5-phosphanyl]-[(4-hydroxyphenyl)methyl]phosphinous acid

• 分子结构分类: 有机化合物 - 苯类化合物 - 酚类
• 英文名称: [Ditert-butyl-hydroxy-[(4-hydroxyphenyl)methyl]-lambda5-phosphanyl]-[(4-hydroxyphenyl)methyl]phosphinous acid
• 英文别名: [ditert-butyl-hydroxy-[(4-hydroxyphenyl)methyl]-λ5-phosphanyl]-[(4-hydroxyphenyl)methyl]phosphinous acid
• 化学式: C₂₂H₃₄O₄P₂
• 分子量: 424.4
• InChiKey: ZOHWEBGTZUDYGZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.1
• 重原子数：
  28
• 可旋转键数：
  7
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.45
• 拓扑面积：
  80.9
• 氢给体数：
  4
• 氢受体数：
  4

文献信息

• Polymer Composition for Producing Articles with Light Reflective Properties
  申请人：TICONA LLC

  公开号：US20140128504A1

  公开（公告）日：2014-05-08

  Polymer compositions are described containing a thermoplastic polymer in combination with one or more components, such as a white pigment and optionally one or more reinforcing fillers. In one embodiment, the polymer composition can be formulated to have high reflective properties. In other embodiments, the polymer composition can be formulated so as to have desired melt flow characteristics. In still another embodiment, the polymer composition can be formulated so as to have desired mechanical properties, such as impact resistance.
• Reflector for Light-Emitting Devices
  申请人：Ticona LLC

  公开号：US20140299907A1

  公开（公告）日：2014-10-09

  Polymer compositions are described that are well suited for producing reflectors for light-emitting devices, such as light-emitting diodes. In one embodiment, the polymer composition contains a polymer resin and a stabilizer comprising a phosphonate compound and/or a phosphate compound and optionally a white pigment. The polymer resin may comprise, for instance, a poly(1,4-cyclohexanedimethanol terephthalate). The phosphate stabilizer has been found to significantly improve the stability of the polymer composition without interfering with the ability of the composition to bond to other polymer materials, such as silicone resins. Silicone resins, for instance, are typically used as an encapsulant for light-emitting diode assemblies.
• US9187621B2
  申请人：——

  公开号：US9187621B2

  公开（公告）日：2015-11-17
• US9453119B2
  申请人：——

  公开号：US9453119B2

  公开（公告）日：2016-09-27