申请人:MEMC SINGAPORE, PTE. LTD (UEN200614797D)
公开号:US20140144846A1
公开(公告)日:2014-05-29
A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.