Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias.
卤化
嘧啶和亲核连接单元的反应产物被加入
金属电镀液中,以提供良好的抛掷力。电镀槽可用于在印刷电路板和半导体上电镀
铜、
锡及其合
金等
金属,并填充通孔和孔洞。