申请人:Senju Metal Industry Co., Ltd.
公开号:EP4063060A1
公开(公告)日:2022-09-28
Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.
本文提供了可改善焊料润湿性的助焊剂,以及使用该助焊剂的焊膏。该助焊剂含有 0.5-20.0 wt%的(2-羧基烷基)异氰尿酸酯加合物和 5.0-45.0 wt%的松香,还含有一种溶剂。(2-羧基烷基)异氰尿酸酯加合物是单(2-羧基烷基)异氰尿酸酯加合物、双(2-羧基烷基)异氰尿酸酯加合物、三(2-羧基烷基)异氰尿酸酯加合物或其中两种或两种以上的组合。