3,4-dihydro-2H-benzo[h][1,3]benzoxazine

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并恶嗪类
• 英文名称: 3,4-dihydro-2H-benzo[h][1,3]benzoxazine
• 化学式: C₁₂H₁₁NO
• 分子量: 185.22
• InChiKey: DZEHOIFMVSRLEJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  14
• 可旋转键数：
  0
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.17
• 拓扑面积：
  21.3
• 氢给体数：
  1
• 氢受体数：
  2

文献信息

• RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP3790039A1

  公开（公告）日：2021-03-10

  A resin composition that has excellent adhesiveness to chips and substrates such as printed wiring boards and excellent flux activity is provided. The present invention provides a resin composition containing: a benzoxazine compound (A); an organic compound (B) having a flux function; and at least one thermosetting component (C) selected from a phenolic resin and a radical polymerizable thermosetting resin, wherein the radical polymerizable thermosetting resin is a resin or a compound having at least one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group and a (meth)acryloyl group, and wherein a mass ratio between the benzoxazine compound (A) and the thermosetting component (C) ((A)/(C)) is 20/80 to 90/10.

  本发明提供了一种对芯片和基材（如印刷线路板）具有优异粘合性和优异助焊剂活性的树脂组合物。本发明提供了一种树脂组合物，其中含有一种苯并恶嗪化合物 (A)； 一种具有助焊剂功能的有机化合物 (B)；和至少一种选自酚醛树脂和可自由基聚合的热固性树脂的热固性组分 (C)，其中可自由基聚合的热固性树脂是具有至少一个或多个选自烯基、马来酰亚胺基和（甲基）丙烯酰基的官能团的树脂或化合物，并且苯并恶嗪化合物 (A) 和热固性组分 (C) 之间的质量比（(A)/(C)）为 20/80 至 90/10。