2,2'-[Naphthalene-2,3-diylbis(oxymethylene)]bis(oxirane) | 34898-97-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 2,2'-[Naphthalene-2,3-diylbis(oxymethylene)]bis(oxirane)
• 英文别名: 2-[[3-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane
• CAS: 34898-97-0
• 化学式: C₁₆H₁₆O₄
• 分子量: 272.301
• InChiKey: MPYZUNNAXVBHDC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  20
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.38
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  2,2'-[Naphthalene-2,3-diylbis(oxymethylene)]bis(oxirane) 、 丙烯酸 在 苄基三乙基氯化铵 、 对苯二酚 作用下， 生成 [2-Hydroxy-3-[3-(2-hydroxy-3-prop-2-enoyloxypropoxy)naphthalen-2-yl]oxypropyl] prop-2-enoate
  参考文献：
  名称：

  二丙烯酸/二乙烯基苯共聚物的合成，表征和热性能

  摘要：

  本文介绍了基于新型芳族四官能丙烯酸酯单体的二丙烯酸/二乙烯基苯共聚物的合成，表征和热性能。通过处理衍生自各种芳族二醇的环氧化物生成新的单体：萘-2,3-二醇（NAF），联苯-4,4'-二醇（BIF），双（4-羟苯基）甲酮（BEP）或4 ，4'-硫代双酚（BES）和环氧氯丙烷与丙烯酸。在0.7重量％的三乙基苄基氯化铵（TEBAC）作为催化剂和0.045重量％的对苯二酚作为聚合抑制剂的存在下，以0.5摩尔合适的环氧衍生物和1摩尔丙烯酸的比例进行加成反应。制备的丙烯酸酯单体的化学结构由13确定1 H NMR和GC MS光谱。在成孔稀释剂（甲苯+ decan-1-ol）存在下，丙烯酸酯单体与二乙烯基苯（DVB）的乳液悬浮聚合可以得到含有侧基官能团（羟基）的微球。该过程在丙烯酸酯单体：DVB（1：1）的恒定摩尔比和成孔稀释剂与单体（1：1）的恒定体积比下进行。与十烷-1-醇的混合物中不同浓度的甲苯用

  DOI：

  10.1007/s10973-009-0574-6
• 作为产物：
  描述：

  2,3-二羟基萘 、 环氧氯丙烷 生成 2,2'-[Naphthalene-2,3-diylbis(oxymethylene)]bis(oxirane)
  参考文献：
  名称：

  二丙烯酸/二乙烯基苯共聚物的合成，表征和热性能

  摘要：

  本文介绍了基于新型芳族四官能丙烯酸酯单体的二丙烯酸/二乙烯基苯共聚物的合成，表征和热性能。通过处理衍生自各种芳族二醇的环氧化物生成新的单体：萘-2,3-二醇（NAF），联苯-4,4'-二醇（BIF），双（4-羟苯基）甲酮（BEP）或4 ，4'-硫代双酚（BES）和环氧氯丙烷与丙烯酸。在0.7重量％的三乙基苄基氯化铵（TEBAC）作为催化剂和0.045重量％的对苯二酚作为聚合抑制剂的存在下，以0.5摩尔合适的环氧衍生物和1摩尔丙烯酸的比例进行加成反应。制备的丙烯酸酯单体的化学结构由13确定1 H NMR和GC MS光谱。在成孔稀释剂（甲苯+ decan-1-ol）存在下，丙烯酸酯单体与二乙烯基苯（DVB）的乳液悬浮聚合可以得到含有侧基官能团（羟基）的微球。该过程在丙烯酸酯单体：DVB（1：1）的恒定摩尔比和成孔稀释剂与单体（1：1）的恒定体积比下进行。与十烷-1-醇的混合物中不同浓度的甲苯用

  DOI：

  10.1007/s10973-009-0574-6

文献信息

• Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same
  申请人：HITACHI, LTD.

  公开号：EP0810249A2

  公开（公告）日：1997-12-03

  A highly thermal-conductive and thermal-resistant electrically insulated coil with less outflow of a thermosetting resin composition can be produced, to provide a small-scale, light-weight rotating machine with high power. The thermosetting resin composition comprising (a) a polyfunctional epoxy resin containing three or more p-(2,3-epoxypropoxy)phenyl groups and a group represented by the Chemical formula 1; or an epoxy resin with a naphthalene backbone, represented by the Chemical formula 3, 4 or 5 or an epoxy resin with an anthracene backbone, such as diglycidyl ether of anthracene diol and triglycidyl ether of anthracene triol; (b) a bifunctional epoxy resin containing two p-(2,3-epoxypropoxy)phenyl groups; (c) an acid anhydride curing agent; and (d) a metal acetonate curing catalyst represented by the Chemical formula 2 at 0.1 to 5 parts by weight per 100 parts by weight of the epoxy resins. In accordance with the present invention, a highly thermal-conductive and thermal-resistant electrically insulated coil with less outflow of the thermosetting resin composition can be produced, to provide a small-scale, light-weight rotating machine armature with high power.

  可以生产出热固性树脂组合物流出量较少的高导热性和耐热性电绝缘线圈，从而提供一种小型、轻质、高功率的旋转机械。 热固性树脂组合物包括 (a) 多官能环氧树脂，含有三个或三个以上对(2,3-环氧丙氧基)苯基和一个化学式 1 所代表的基团；或化学式 3、4 或 5 所代表的以萘为骨架的环氧树脂，或以蒽为骨架的环氧树脂，如蒽二醇二缩水甘油醚和蒽三醇三缩水甘油醚； (b) 含有两个对(2,3-环氧丙氧基)苯基的双官能环氧树脂； (c) 酸酐固化剂；以及 (d) 由化学式 2 表示的金属丙酮酸盐固化催化剂，以每 100 份环氧树脂的重量计， 其含量为 0.1 至 5 份。 根据本发明，可以生产出一种热固性树脂组合物流出量较少的高导热性和耐热性电绝缘线圈，以提供一种具有高功率的小型轻质旋转机器电枢。
• CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT OF ARYLENE COMPOUND HAVING GLYCIDYL GROUP
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20210403635A1

  公开（公告）日：2021-12-30

  A protective film forming composition forms a flat film having good mask function against a wet etching liquid during a semiconductor substrate processing, high dry etching rate and good coverage of a substrate with level difference, while having small film thickness difference after embedding. A protective film is produced using this composition. A substrate has a resist pattern. A method produces a semiconductor device. A composition forms a protective film against a wet etching liquid for semiconductors, containing a solvent and a ring-opened polymer (C) obtained by reaction between a diepoxy compound (A) and a bi- or higher functional proton-generating compound (B). The ring-opened polymer (C) is preferably represented by a unit structure of formula (A-1). (In formula (A-1), Q represents a divalent organic group generated by the diepoxy compound (A) ring-opening polymerization; and T represents a divalent organic group derived from the bi- or higher functional proton-generating compound (B)).
• CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20220145119A1

  公开（公告）日：2022-05-12

  A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).
• METHOD FOR PRODUCING POLYMER
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20220153920A1

  公开（公告）日：2022-05-19

  Provided is a method for producing a polymer, characterized by reacting (A) an epoxy compound having two or more epoxy groups in the molecule with (B) a reactive compound having, in the molecule, two or more functional groups reactive with epoxy groups, in the presence of (C) a polymerization catalyst and (D) a cocatalyst.
• CHEMICAL-RESISTANT POLYVALENT CARBOXYLIC ACID-CONTAINING PROTECTIVE FILM
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20220404706A1

  公开（公告）日：2022-12-22

  A protective film forming composition which has a good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even for a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using the composition; a substrate with a resist pattern; and a method for producing a semiconductor device. This composition contains: (A) a compound having three or more carboxyl groups; (B) a resin or a monomer; and a solvent. The compound (A) having three or more carboxyl groups preferably has a ring structure. This ring structure is preferably selected from among an aromatic ring having 6-40 carbon atoms, an aliphatic ring having 3-10 carbon atoms, and a heterocyclic ring.