申请人:Sumitomo Chemical Company, Ltd.
公开号:EP3496174A1
公开(公告)日:2019-06-12
An ink composition comprising a P-type semiconductor material, an N-type semiconductor material and two or more solvents including a first solvent and a second solvent, wherein
the total amount of the first solvent and the second solvent is 70% by weight or more with respect to 100% by weight of all the solvents contained in the ink composition;
the boiling point of the first solvent is lower than the boiling point of the second solvent;
the boiling point of the first solvent is 120°C or more and 400°C or less; and
the hydrogen bond Hansen solubility parameter H1 (MPa0.5) of the first solvent and the hydrogen bond Hansen solubility parameter H2 (MPa0.5) of the second solvent are in the relation of 0.5 ≤ (H2-H1) ≤ 5.0;
the first solvent is an aromatic hydrocarbon solvent;
the P-type semiconductor material is a polymer compound comprising a repeating unit represented by the following (1-1) and/or the following formula (II-1) to (II-4) or (II-6):
wherein, Z represents a divalent group represented by (Z-1) to (Z-7),
wherein,
X1 and X2 each independently represent an oxygen atom or a sulfur atom, R represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono-valent heterocyclic group, a substituted amino group, an acyl group, an imine residue, a substituted amide group, an acid imide group, a substituted carboxyl group, an alkenyl group, an alkynyl group, a cyano group or a nitro group.
一种油墨组合物,包括一种 P 型半导体材料、一种 N 型半导体材料和两种或两种以上的溶剂,包括第一种溶剂和第二种溶剂,其中
第一种溶剂和第二种溶剂的总量占油墨组合物所含全部溶剂重量的 70% 或以上(按重量计);
第一种溶剂的沸点低于第二种溶剂的沸点;
第一种溶剂的沸点为 120°C 或以上,400°C 或以下;以及
第一种溶剂的氢键汉森溶解度参数 H1 (MPa0.5) 和第二种溶剂的氢键汉森溶解度参数 H2 (MPa0.5) 的关系为 0.5 ≤ (H2-H1) ≤ 5.0;
第一种溶剂是芳香烃溶剂;
所述 P 型半导体材料为聚合物化合物,其包含由下式(1-1)和/或下式(II-1)至 (II-4)或(II-6)表示的重复单元:
其中,Z 代表由 (Z-1) 至 (Z-7) 所代表的二价基团、
其中
X1和X2各自独立地代表氧原子或硫原子,R代表氢原子、卤素原子、烷基、芳基、烷氧基、芳氧基、烷硫基、芳硫基、单价杂环基、取代的氨基、酰基、亚胺残基、取代的酰胺基、酸亚胺基、取代的羧基、烯基、炔基、氰基或硝基。