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6-[[7-(N,N-二甲氨基磺酰)-2,1,3-苯并恶二唑-4-基]氨基]己酸琥珀酰亚胺酯 | 1858255-08-9

中文名称
6-[[7-(N,N-二甲氨基磺酰)-2,1,3-苯并恶二唑-4-基]氨基]己酸琥珀酰亚胺酯
中文别名
琥珀酰亚氨基-6-[[7-(N,N-二甲氨基磺酰)-2,1,3-苯并恶二唑-4-基]氨基]己酸盐
英文名称
Succinimidyl 6-[[7-(N,N-Dimethylaminosulfonyl)-2,1,3-benzoxadiazol-4-yl]amino]hexanoate
英文别名
(2,5-dioxopyrrolidin-1-yl) 6-[[4-(dimethylsulfamoyl)-2,1,3-benzoxadiazol-7-yl]amino]hexanoate
6-[[7-(N,N-二甲氨基磺酰)-2,1,3-苯并恶二唑-4-基]氨基]己酸琥珀酰亚胺酯化学式
CAS
1858255-08-9
化学式
C18H23N5O7S
mdl
——
分子量
453.5
InChiKey
MMPAJYBUTABRFE-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 熔点:
    137.0 ~141.0 °C
  • 沸点:
    643.5±65.0 °C(Predicted)
  • 密度:
    1.48±0.1 g/cm3(Predicted)
  • 溶解度:
    溶于四氢呋喃

计算性质

  • 辛醇/水分配系数(LogP):
    0.3
  • 重原子数:
    31
  • 可旋转键数:
    11
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.5
  • 拓扑面积:
    160
  • 氢给体数:
    1
  • 氢受体数:
    11

文献信息

  • POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
    申请人:FUJIMI INCORPORATED
    公开号:EP2237311A1
    公开(公告)日:2010-10-06
    A polishing composition according to a first aspect of the present invention contains a nitrogen-containing compound and abrasive grains, and the pH of the composition is in the range of 1 to 7. The nitrogen-containing compound in the polishing composition preferably has a structure expressed by a formula: R1-N(-R2)-R3 in which R1, R2, and R3 each represent an alkyl group with or without a characteristic group, two of R1 to R3 may form a part of a heterocycle, and two of R1 to R3 may be identical and form a part of a heterocycle with the remaining one, Alternatively, the nitrogen-containing compound is preferably selected from a group consisting of a carboxybetaine type ampholytic surfactant, a sulfobetaine type ampholytic surfactant, an imidazoline type ampholytic surfactant, and an amine oxide type ampholytic surfactant. A polishing composition according to a second aspect of the present invention contains a water-soluble polymer and abrasive grains, and the pH of the composition is in the range of 1 to 8.
    根据本发明第一方面的抛光组合物含有含氮化合物和磨粒,组合物的 pH 值在 1 至 7 之间。抛光组合物中的含氮化合物最好具有由式表示的结构:R1-N(-R2)-R3,其中 R1、R2 和 R3 各代表一个带或不带特征基团的烷基,R1 至 R3 中的两个可构成杂环的一部分,R1 至 R3 中的两个可相同并与其余一个构成杂环的一部分,或者,R1 至 R3 中的两个可相同并与其余一个构成杂环的一部分,或者,R1 至 R3 中的两个可相同并与其余一个构成杂环的一部分、含氮化合物最好选自由羧基甜菜碱型两性表面活性剂、磺基甜菜碱型两性表面活性剂、咪唑啉型两性表面活性剂和氧化胺型两性表面活性剂组成的组。根据本发明第二方面的抛光组合物含有溶性聚合物和磨粒,组合物的 pH 值在 1 至 8 之间。
  • Polishing composition and polishing method using the same
    申请人:Mizuno Takahiro
    公开号:US10144849B2
    公开(公告)日:2018-12-04
    A polishing composition contains a nitrogen-containing compound and abrasive grains, and the pH of the composition is in the range of 1 to 7. The nitrogen-containing compound in the polishing composition preferably has a structure expressed by a formula: R1—N(—R2)—R3 in which R1, R2, and R3 each represent an alkyl group with or without a characteristic group, two of R1 to R3 may form a part of a heterocycle, and two of R1 to R3 may be identical and form a part of a heterocycle with the remaining one. Alternatively, the nitrogen-containing compound is preferably selected from a group consisting of a carboxybetaine type ampholytic surfactant, a sulfobetaine type ampholytic surfactant, an imidazoline type ampholytic surfactant, and an amine oxide type ampholytic surfactant. A polishing composition may contain a water-soluble polymer and abrasive grains, and the pH of the composition is in the range of 1 to 8.
    一种抛光组合物含有一种含氮化合物和磨粒,组合物的 pH 值在 1 至 7 之间。抛光组合物中的含氮化合物最好具有由式表示的结构:R1-N(-R2)-R3,其中 R1、R2 和 R3 各代表一个带或不带特征基团的烷基,R1 至 R3 中的两个可构成杂环的一部分,R1 至 R3 中的两个可相同并与其余一个构成杂环的一部分。另外,含氮化合物最好选自羧基甜菜碱型两性表面活性剂、磺基甜菜碱型两性表面活性剂、咪唑啉型两性表面活性剂和氧化胺型两性表面活性剂组成的组。抛光组合物可包含溶性聚合物和磨粒,组合物的 pH 值范围为 1 至 8。
  • Polishing Composition and Polishing Method Using the Same
    申请人:Mizuno Takahiro
    公开号:US20100301014A1
    公开(公告)日:2010-12-02
    A polishing composition contains a nitrogen-containing compound and abrasive grains, and the pH of the composition is in the range of 1 to 7. The nitrogen-containing compound in the polishing composition preferably has a structure expressed by a formula: R 1 —N(—R 2 )—R 3 in which R 1 , R 2 , and R 3 each represent an alkyl group with or without a characteristic group, two of R 1 to R 3 may form a part of a heterocycle, and two of R 1 to R 3 may be identical and form a part of a heterocycle with the remaining one. Alternatively, the nitrogen-containing compound is preferably selected from a group consisting of a carboxybetaine type ampholytic surfactant, a sulfobetaine type ampholytic surfactant, an imidazoline type ampholytic surfactant, and an amine oxide type ampholytic surfactant. A polishing composition may contain a water-soluble polymer and abrasive grains, and the pH of the composition is in the range of 1 to 8.
  • RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE
    申请人:KAWASHIMA Takashi
    公开号:US20120146264A1
    公开(公告)日:2012-06-14
    A resin composition for laser engraving is provided that includes a low molecular weight compound containing at least one type of polymerizable group selected from the group consisting of an ethylenically unsaturated group, an epoxy group, an oxetanyl group, a hydrolyzable silyl group, and a silanol group and further containing a sulfonamide group, a low molecular weight compound containing a residue selected from the group consisting of a maleimide group, a succinimide group, and a phthalimide group, or a polymer compound containing a constituent unit derived from a compound containing a maleimide group or a constituent unit containing a sulfonamide group.
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