申请人:Watanabe Hisashi
公开号:US20100059261A1
公开(公告)日:2010-03-11
A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I):
wherein one of X and Y represents O and the other represents NAr
2
R
2
, and R
1
, R
2
, Ar
1
, and Ar
2
are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.
用于具有高可靠性和允许加工细小线路的柔性印制线路板的材料包括由以下一般式(I)表示的化合物:其中X和Y中的一个表示O,另一个表示NAr2R2,R1,R2,Ar1和Ar2如规范中所定义,以及包含该化合物作为反应单体的树脂组成物。