Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25 × 10⁻⁴ cal/cm-sec-°C) and improved stress characteristics (e.g., a thermal shock cycle number of at least 30).
用具有碳化
硅填料的封装
树脂封装电子元件,以形成具有改进的导热性(例如,大于 25 × 10-⁴ cal/cm-sec-°C)和改进的应力特性(例如,热冲击循环次数至少为 30)的复合材料。