ALKOXYSILANE/ORGANIC POLYMER COMPOSITION FOR THIN INSULATING FILM PRODUCTION AND USE THEREOF
申请人:Asahi Kasei Kogyo Kabushiki Kaisha
公开号:EP0997497A1
公开(公告)日:2000-05-03
Disclosed is an alkoxysilane/organic polymer composition for use in producing an insulating thin film, comprising (A) a specific alkoxysilane; (B) a specific organic polymer; and (C) a solvent for alkoxysilane (A) and organic polymer (B), wherein solvent (C) comprises at least one organic solvent selected from the group consisting of amide linkage-containing organic solvents and ester linkage-containing organic solvents. Also disclosed are a silica-organic polymer composits thin film which is produced by a process comprising: forming a thin film of the composition of the present invention; subjecting the thin film to a hydrolysis and dehydration-condensation reaction with respect to the alkoxysilane thereof, to thereby cause the alkoxysilane to be gelled in the thin film; and removing the solvent remaining in the thin film by drying, and a porous silica thin film which is obtained by removing the organic polymer from the silica-organic polymer composite thin film. Both of the silica-organic polymer composite thin film and the porous silica thin film have advantages not only in that these thin films have a low dielectric constant suitable for insulating layers for a multilevel interconnect for a semiconductor device, but also in that these thin films can be produced by a method which can be easily performed in the current process for producing a semiconductor device.
本发明公开了一种用于生产绝缘薄膜的烷氧基硅烷/有机聚合物组合物,包括(A)特定的烷氧基硅烷;(B)特定的有机聚合物;和(C)烷氧基硅烷(A)和有机聚合物(B)的溶剂,其中溶剂(C)包括至少一种选自含酰胺链有机溶剂和含酯链有机溶剂组成的组的有机溶剂。本发明还公开了一种二氧化硅-有机聚合物复合薄膜,其生产工艺包括:形成本发明组合物的薄膜;使薄膜与其中的烷氧基硅烷发生水解和脱水-缩合反应,从而使烷氧基硅烷在薄膜中胶化;通过干燥除去薄膜中残留的溶剂;以及通过从二氧化硅-有机聚合物复合薄膜中除去有机聚合物而得到的多孔二氧化硅薄膜。二氧化硅-有机聚合物复合薄膜和多孔二氧化硅薄膜的优点不仅在于这些薄膜的介电常数较低,适合用作半导体器件多级互连的绝缘层,而且还在于这些薄膜可以通过在目前生产半导体器件的工艺中很容易执行的方法生产出来。