Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same
申请人:Ishigaki Satoru
公开号:US20070218305A1
公开(公告)日:2007-09-20
There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizeable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1):
CH
2
═CH—COO—R—NCO (1)
(wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).
本发明提供了一种新型的光敏树脂组合物,其固化膜具有充足的柔韧性,并且产生的绝缘保护涂层具有优异的焊接耐热性,热降解耐性和无电镀金耐性。本发明所述的光敏树脂组合物包括:含有尿素丙烯酸酯化合物(A)和除所述尿素丙烯酸酯化合物(A)以外的具有乙烯基不饱和基团的化合物(B)的光聚合组分,热固性树脂(C),光聚合引发剂(D)和热聚合催化剂(E);其中,所述尿素丙烯酸酯化合物(A)是以下一般式(1)的异氰酸酯化合物(a-1)和多羟基化合物(a-2)的反应产物:CH2═CH—COO—R—NCO (1)(其中,R代表具有1至30个碳原子的碳氢基团)。