1,6-Dipropoxynaphthalene

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 1,6-Dipropoxynaphthalene
• 英文别名: 1,6-dipropoxynaphthalene
• 化学式: C₁₆H₂₀O₂
• 分子量: 244.33
• InChiKey: ZFXVSLIQIYDRAO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.9
• 重原子数：
  18
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.38
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• Radiation-sensitive resin composition and electronic device
  申请人：ZEON CORPORATION

  公开号：US10025182B2

  公开（公告）日：2018-07-17

  A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30° C. or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity.

  本发明提供了一种辐射敏感树脂组合物，该组合物由粘合剂树脂（A）、辐射敏感化合物（B）、环氧当量为 450 或以下且软化点为 30 摄氏度或以下的四官能度或更低官能度环氧基交联剂（C）和芳基苯酚树脂（D）组成。根据本发明，可以提供一种辐射敏感性树脂组合物，该树脂组合物能够生成与金属层粘附性高、显影性好和吸湿性低的树脂膜。
• NOVEL SULFONIUM SALT COMPOUND, METHOD FOR PRODUCING THE SAME, AND PHOTOACID GENERATOR
  申请人：DSP GOKYO FOOD & CHEMICAL CO., LTD.

  公开号：US20150293445A1

  公开（公告）日：2015-10-15

  Provided is a sulfonium salt compound represented by the following general formula (I): where R 1 and R 2 each denote the same or a different alkyl group having 1 to 18 carbon atoms, R 3 and R 4 each denote the same or a different alkyl group having 1 to 10 carbon atoms, and X − denotes a sulfone imide anion or a perfluoroalkanesulfonic acid anion, wherein the substituents denoted by R 3 O and R 4 O are each located at an arbitrary position selected from the 2-position to the 8-position of the naphthyl group.
• RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
  申请人：ZEON CORPORATION

  公开号：US20170023859A1

  公开（公告）日：2017-01-26

  A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30° C., or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity.
• US8952204B2
  申请人：——

  公开号：US8952204B2

  公开（公告）日：2015-02-10
• US9465288B2
  申请人：——

  公开号：US9465288B2

  公开（公告）日：2016-10-11