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4-Propan-2-ylnaphthalene-1,5-diol

中文名称
——
中文别名
——
英文名称
4-Propan-2-ylnaphthalene-1,5-diol
英文别名
4-propan-2-ylnaphthalene-1,5-diol
4-Propan-2-ylnaphthalene-1,5-diol化学式
CAS
——
化学式
C13H14O2
mdl
——
分子量
202.25
InChiKey
ZSEIOLKUTQIRAU-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    3.6
  • 重原子数:
    15
  • 可旋转键数:
    1
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.23
  • 拓扑面积:
    40.5
  • 氢给体数:
    2
  • 氢受体数:
    2

文献信息

  • SENSOR DYES FOR REAL-TIME SENSING OF METAL IONS IN AQUEOUS ENVIRONMENTS
    申请人:The UWM Research Foundation, Inc
    公开号:EP3362518B1
    公开(公告)日:2022-04-27
  • COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
    申请人:DIC CORPORATION
    公开号:US20160122269A1
    公开(公告)日:2016-05-05
    There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.
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