申请人:3M Innovative Properties Company
公开号:US20030054138A1
公开(公告)日:2003-03-20
The invention describes a method of curing a polymerizable material containing ethylenically unsaturated bonds at a temperature of 60° C. or less, comprising the steps of (a) providing a curative comprising an effective amount of a light-stable isomer of a 2,4,5-triarylimidazolyl dimer, such as bilophine; (b) activating said curative by application of an activator selected from the group consisting of solvent and friction; and (c) combining the activated curative with the polymerizable material.
Articles comprising an adhesive having a detackified surface, such as adhesive bandages, a detackifying solution, a two-part adhesive system, and a fastening system are also provided.
本发明描述了一种在 60℃或更低温度下固化含有乙烯不饱和键的可聚合材料的方法, 包括以下步骤:(a)提供一种包含有效量的 2,4,5-三芳基咪唑二聚体的光稳定异构体的固化剂, 例如比洛芬;(b)通过使用选自溶剂和摩擦的组中的活化剂来活化所述固化剂;以及(c)将活化 的固化剂与可聚合材料结合。
此外,还提供了由具有解包表面的粘合剂(如粘合绷带)、解包溶液、双组份粘合剂系统和紧固系统组成的物品。