2,6-Dihydroxynaphthalene-1,5-dicarboxylic acid | 918636-54-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 2,6-Dihydroxynaphthalene-1,5-dicarboxylic acid
• CAS: 918636-54-1
• 化学式: C₁₂H₈O₆
• 分子量: 248.19
• InChiKey: YTFJYGJLUDTNOI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  18
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  115
• 氢给体数：
  4
• 氢受体数：
  6

文献信息

• INTEGRATED PROCESS FOR THE PREPARATION OF POLYBENZIMIDAZOLE PRECURSORS
  申请人：DHAWAN Rajiv

  公开号：US20100160679A1

  公开（公告）日：2010-06-24

  Processes are provided for preparing complexes of 2,3,5,6-tetraaminotoluene with an aromatic diacid where the aromatic diacid is insoluble in water under ambient conditions. An integrated process design starting with nitration of 2,6-dihalotoluene eliminates costly intermediate drying and recrystallization steps. Handling of solid materials with possible skin sensitizing properties and toxicity is avoided, thereby eliminating human and environmental exposure.

  提供了一种制备2,3,5,6-四氨基甲苯与芳香二酸络合物的工艺，其中芳香二酸在常温下不溶于水。从对2,6-二卤代甲苯的硝化开始的综合工艺设计，消除了昂贵的中间干燥和重结晶步骤。避免了固体材料可能具有致敏性和毒性的处理，从而消除了人类和环境的暴露。
• PROCESS FOR THE SYNTHESIS OF HYDROXY AROMATIC ACIDS
  申请人：Ritter Joachim C.

  公开号：US20080139843A1

  公开（公告）日：2008-06-12

  Hydroxy aromatic acids are produced in high yields and high purity (>95%) from halogenated aromatic acids in a reaction mixture containing a copper source and a ligand that coordinates to copper.

  含卤素的芳香酸在反应混合物中，加入铜源和配位于铜的配体，可以高产高纯度（> 95％）地制备羟基芳香酸。
• COMPOSITION CONTAINING HYDROXYLATED CONDENSATION RESIN FOR FORMING FILM UNDER RESIST
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP2042927A1

  公开（公告）日：2009-04-01

  Disclosed is a lithographic composition for forming a resist underlayer film, which can be used as a lower layer antireflection film by which an exposure light striking on a photoresist formed on a semiconductor substrate is inhibited from being reflected from the substrate in a lithographic process of manufacturing semiconductor equipment, a planarization film for flattening a semiconductor substrate having a rugged surface used in order to fill in a hole formed on the semiconductor substrate, a film which prevents a photoresist from being contaminated by a substance generated from a semiconductor substrate during heating/burning, or the like. The lithographic composition for forming a resist underlayer comprises a polymer having a structure of formula (1): (where Y represents a C1-10 alkylene group or a C6-14 aromatic ring, provided that the alkylene group and the aromatic ring have one or more hydroxyl group(s) being not larger than the number of the replaceable hydrogen atom of the alkylene group and the aromatic ring); and a solvent.

  本发明公开了一种用于形成抗蚀剂底层膜的平版印刷组合物，该组合物可在制造半导体设备的平版印刷工艺中用作下层抗反射膜，通过该膜可以抑制照射在形成于半导体衬底上的光刻胶上的曝光光从衬底上反射出去；还可用作用于将表面凹凸不平的半导体衬底压平的平版印刷膜，以填充形成于半导体衬底上的孔洞；还可用作防止光刻胶在加热/燃烧过程中被半导体衬底产生的物质污染的膜等。用于形成抗蚀剂底层的平版印刷组合物包括具有式（1）结构的聚合物： (其中 Y 代表 C1-10 亚烷基或 C6-14 芳环，条件是亚烷基和芳环具有一个或多个羟基，其数目不大于亚烷基和芳环的可取代氢原子数）；以及溶剂。
• METHOD OF MAKING AROMATIC DIHYDROXY DIACID DIHALIDES AND PRECIPITATES RESULTING THEREFROM
  申请人：E.I. du Pont de Nemours and Company

  公开号：EP1931617A2

  公开（公告）日：2008-06-18
• Dihydroxy aramid polymers
  申请人：Lee Kiu-Seung

  公开号：US20070015896A1

  公开（公告）日：2007-01-18

  The present invention relates to dihydroxy aramid polymers such as formed by contacting an aromatic diamine with an aromatic dihydroxy diacid dihalide.