Phase separation in InGaN grown by metalorganic chemical vapor deposition
作者:N. A. El-Masry、E. L. Piner、S. X. Liu、S. M. Bedair
DOI:10.1063/1.120639
日期:1998.1.5
We report on phaseseparation in thick InGaN films with up to 50% InN grown by metalorganicchemicalvapordeposition from 690 to 780 °C. InGaN films with thicknesses of 0.5 μm were analyzed by θ–2θ x-ray diffraction, transmission electron microscopy (TEM), and selected area diffraction (SAD). Single phase InGaN was obtained for the as-grown films with <28% InN. However, for films with higher than
我们报告了通过金属有机化学气相沉积在 690 至 780 °C 下生长的高达 50% InN 厚 InGaN 薄膜的相分离。通过 θ–2θ x 射线衍射、透射电子显微镜 (TEM) 和选区衍射 (SAD) 分析厚度为 0.5 μm 的 InGaN 薄膜。对于 <28% InN 的生长薄膜,获得了单相 InGaN。然而,对于 InN 含量高于 28% 的薄膜,样品显示出经 TEM 证实的旋节线分解微观结构和 SAD 图案中与多相 InGaN 相对应的额外斑点。
Impurity dependence on hydrogen and ammonia flow rates in InGaN bulk films
作者:E. L. Piner、M. K. Behbehani、N. A. El-Masry、J. C. Roberts、F. G. McIntosh、S. M. Bedair
DOI:10.1063/1.119775
日期:1997.10.6
H, C, and O impurity concentrations in metalorganic chemical vapor deposition grown InGaN were found to be dependent on the hydrogen and NH3 flowrates. By increasing the hydrogenflowrate from 0 to 100 sccm, a decrease of greater than two orders of magnitude in the C and O impurity levels and one order of magnitude in the H impurity level was observed. Increasing the NH3 flowrate from 1 to 5 slm
发现金属有机化学气相沉积生长的 InGaN 中的 H、C 和 O 杂质浓度取决于氢气和 NH3 的流速。通过将氢气流速从 0sccm 增加到 100sccm,观察到 C 和 O 杂质水平下降超过两个数量级,H 杂质水平下降一个数量级。将 NH3 流速从 1 slm 增加到 5 slm 会导致 C 浓度降低以及 H 和 O 浓度增加,这表明高纯度 NH3 (99.999%) 可能是 O 污染的重要来源。其他研究表明,当 InGaN 薄膜中的 InN 百分比增加时,无论生长条件如何变化,杂质浓度都会增加。
Strain‐relaxed epitaxial layers for high‐speed electronic devices
作者:G. W. Wang
DOI:10.1063/1.105390
日期:1991.7.29
of high‐speedelectronicdevices beyond the limit of pseudomorphic heterostructures is investigated. Metal‐semiconductor field‐effect transistors (MESFETs) are fabricated on InGaAs layers which have intentionally relaxed crystal lattice on GaAs substrate to take advantage of the small effective electron mass of bulk InGaAs materials. 0.25 μm gate MESFETs with an unstrained In0.15Ga0.85As layer and
Growth of GaInAsP using ethyldimethylindium and tertiarybutylphosphine
作者:P. R. Sharps、M. L. Timmons、T. S. Colpitts
DOI:10.1063/1.105022
日期:1991.5.6
The growth of GaInAsP lattice matched to GaAs by organometallic vapor phase epitaxy usingethyldimethylindium and tertiarybutylphosphine is reported for the first time. The composition of the films is approximately Ga0.87In0.13As0.75P0.25, giving a band gap of about 1.52 eV. Intrinsic films are n type. Both n‐ and p‐type doped layers have been prepared. Photoluminescence measurements on intrinsic films
Determination of the critical layer thickness in the InGaN/GaN heterostructures
作者:C. A. Parker、J. C. Roberts、S. M. Bedair、M. J. Reed、S. X. Liu、N. A. El-Masry
DOI:10.1063/1.125146
日期:1999.11
We present an approach to determine the criticallayerthickness in the InxGa1−xN/GaN heterostructure based on the observed change in the photoluminescence emission as the InxGa1−xN film thickness increases. From the photoluminescence data, we identify the criticallayerthickness as the thickness where a transition occurs from the strained to unstrained condition, which is accompanied by the appearance
我们提出了一种方法来确定 InxGa1-xN/GaN 异质结构中的临界层厚度,基于观察到的光致发光发射随着 InxGa1-xN 膜厚度的增加而变化。从光致发光数据中,我们将临界层厚度确定为从应变到非应变条件发生转变的厚度,这伴随着深能级发射的出现和带边缘光致发光强度的下降。指示临界层厚度开始的光学数据也通过 InxGa1-xN 表面形态随厚度的变化得到证实,并且与 X 射线衍射测量一致。