PHENOLIC HYDROXYL GROUP-CONTANING COMPOUND, PHENOLIC HYDROXYL GROUP-CONTANING COMPOSITION, (METH)ACRYLOYL GROUP-CONTAINING RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND RESIST MATERIAL
申请人:DIC CORPORATION
公开号:US20150274636A1
公开(公告)日:2015-10-01
The present invention provides a (meth)acryloyl group-containing resin having excellent heat resistance and a phenolic hydroxyl group-containing compound used as a raw material of the resin. A phenolic hydroxyl group-containing compound has a molecular structure represented by general formula (1) below [in the formula, R
1
, R
2
, and R
3
are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, p is an integer of 0 to 4, V is a hydrogen atom, a (meth)acryloyloxy group, or a hydroxyl group, and W, X, and Y are each independently a (meth)acryloyloxy group or a hydroxyl group], wherein at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth)acryloyloxy group.
本发明提供了一种具有优异耐热性的含有(meth)丙烯酰基的树脂,以及一种作为该树脂原料的含酚羟基化合物。含酚羟基的化合物具有以下通式(1)所表示的分子结构[在该式中,R1、R2和R3分别独立地为具有1至8个碳原子的烷基基团,m和n分别独立地为1至4的整数,p为0至4的整数,V为氢原子、(meth)丙烯酰氧基或羟基,W、X和Y分别独立地为(meth)丙烯酰氧基或羟基],其中V、W、X和Y中至少有一个为羟基,至少有一个为(meth)丙烯酰氧基。