1-hydroxy-[2]naphthoic acid-(4-chloro-phenyl ester)

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 1-hydroxy-[2]naphthoic acid-(4-chloro-phenyl ester)
• 英文别名: 1-Hydroxy-[2]naphthoesaeure-(4-chlor-phenylester)；(4-Chlorophenyl) 1-hydroxynaphthalene-2-carboxylate
• 化学式: C₁₇H₁₁ClO₃
• 分子量: 298.726
• InChiKey: CBISBZBSROVAHU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.4
• 重原子数：
  21
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  46.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  4-偶氮基苯磺酸酯 、 1-hydroxy-[2]naphthoic acid-(4-chloro-phenyl ester) 生成 4-[3-(4-chloro-phenoxycarbonyl)-4-hydroxy-[1]naphthylazo]-benzenesulfonic acid
  参考文献：
  名称：

  Über Azofarbstoffe aus Arylestern der 2-Oxy-3-naphthoesäure und der 1-Oxy-2-naphthoesäure

  摘要：

  DOI：

  10.1007/bf01798090
• 作为产物：
  描述：

  对氯苯酚 、 1-羟基-2-萘甲酸 在 xylene 、 三氯氧磷 作用下， 生成 1-hydroxy-[2]naphthoic acid-(4-chloro-phenyl ester)
  参考文献：
  名称：

  Über Azofarbstoffe aus Arylestern der 2-Oxy-3-naphthoesäure und der 1-Oxy-2-naphthoesäure

  摘要：

  DOI：

  10.1007/bf01798090

文献信息

• Heat-sensitive adhesive agent and heat-sensitive adhesive sheet
  申请人：Ricoh Company, Ltd.

  公开号：EP1897925A1

  公开（公告）日：2008-03-12

  Provided is a heat-sensitive adhesive agent that mainly comprises a thermoplastic resin and a heat-meltable substance capable of melting upon heating, and further comprises swellable mica.

  本发明提供了一种热敏粘合剂，它主要由热塑性树脂和加热时能够熔化的热熔物质组成，还包括可膨胀云母。
• Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material
  申请人：Ricoh Company, Ltd.

  公开号：EP1882726A1

  公开（公告）日：2008-01-30

  A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of-70°C to -30°C, and the thermofusible material comprises triphenylphosphine, and at least any one of tris (2,4-di-t-butylphenyl) phosphite and tetrakis [3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine

  一种热敏压敏粘合剂，它至少含有一种热塑性树脂和一种热熔性材料，其中热塑性树脂的玻璃化温度为-70℃至-30℃，热熔性材料包括三苯基膦、三(2. 4-二叔丁基苯基)亚磷酸酯和四[3-(3,5-二叔丁基-4-羟基苯基丙酸]甲烷中的至少任一种，或一种热敏压敏粘合剂、4-二叔丁基苯基）亚磷酸酯和四[3-（3,5-二叔丁基-4-羟基苯基）丙酸]甲烷中的至少任一种，或一种热敏压敏粘合剂，它至少含有一种热塑性树脂、一种热熔性材料和一种非热熔性材料，其中热熔性材料含有三苯基膦
• Heat-sensitive adhesive material
  申请人：Ricoh Company, Ltd.

  公开号：EP2062953A1

  公开（公告）日：2009-05-27

  The present invention provides a heat-sensitive adhesive material comprising a support; and an adhesive under layer, an intermediate layer and a heat-sensitive adhesive layer formed over one surface of the support in this order, wherein the intermediate layer contains at least a thermoplastic resin and hollow particles, the heat-sensitive adhesive layer contains at least a thermoplastic resin, an adhesion imparting agent and a thermofusible material, and the adhesive under layer contains at least a thermoplastic resin, the thermoplastic resin has a glass transition temperature (Tg) of -70°C to -10°C and a mass average molecular mass of 100,000 to 1,500,000.

  本发明提供了一种热敏粘合材料，它包括一个支撑体；以及依次在支撑体的一个表面上形成的粘合剂下层、中间层和热敏粘合剂层，其中，中间层至少含有热塑性树脂和中空颗粒，热敏粘合剂层至少含有热塑性树脂、粘合传导剂和热熔材料，粘合剂下层至少含有热塑性树脂，热塑性树脂的玻璃化转变温度（Tg）为-70℃至-10℃，质量平均分子质量为100,000至1,500,000。
• HEAT-SENSITIVE ADHESIVE MATERIAL
  申请人：KUGA Yutaka

  公开号：US20090130441A1

  公开（公告）日：2009-05-21

  The present invention is to provide a heat-sensitive adhesive material containing a support;,and an adhesive under layer, an intermediate layer and a heat-sensitive adhesive layer formed over one surface of the support in this order, wherein the intermediate layer contains at least a thermoplastic resin and hollow particles, the heat-sensitive adhesive layer contains at least a thermoplastic resin, an adhesion imparting agent and a thermofusible material, and the adhesive under layer contains at least a thermoplastic resin, the thermoplastic resin has a glass transition temperature (Tg) of −70° C. to −10° C. and a mass average molecular mass of 100,000 to 1,500,000.
• US7993732B2
  申请人：——

  公开号：US7993732B2

  公开（公告）日：2011-08-09