α,α-bis(4-hydroxy-2,5-dimethylphenyl)-4-formyltoluene

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: α,α-bis(4-hydroxy-2,5-dimethylphenyl)-4-formyltoluene
• 英文别名: 4-[Bis(4-hydroxy-2,5-dimethylphenyl)methyl]benzaldehyde；4-[bis(4-hydroxy-2,5-dimethylphenyl)methyl]benzaldehyde
• 化学式: C₂₄H₂₄O₃
• 分子量: 360.453
• InChiKey: RZJCWJYWSICRSH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.5
• 重原子数：
  27
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.21
• 拓扑面积：
  57.5
• 氢给体数：
  2
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  2,5-二甲基苯酚 、 对苯二甲醛 在 对甲苯磺酸 作用下， 以 5,5-dimethyl-1,3-cyclohexadiene 为溶剂， 反应 24.0h， 以88%的产率得到α,α-bis(4-hydroxy-2,5-dimethylphenyl)-4-formyltoluene
  参考文献：
  名称：

  Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde

  摘要：

  用于形成具有高干法蚀刻抗性、抗扭曲性并具有良好的平整性和嵌入性能的抗蚀底层膜形成组合物，包括通过使含有芳香环的有机化合物A和至少具有两个含酚羟基的芳香烃环团的醛B反应而获得的树脂，并具有芳香烃环团通过三级碳原子键合的结构。醛B可以是化合物的化学式（1）： 所得的树脂可能具有化学式（2）的单元结构： Ar1和Ar2各自是C6-40芳基团。含有芳香环的有机化合物A可能是芳香胺或含酚羟基的化合物。该组合物可能进一步含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成抗蚀图案，包括通过将抗蚀底层膜形成组合物涂覆在半导体衬底上并对其进行烘烤来形成抗蚀底层膜。

  公开号：

  US10017664B2

文献信息

• TRANSPARENT FLUORINE-CONTAINING POLYMER
  申请人：Kubota Toshio

  公开号：US20120148808A1

  公开（公告）日：2012-06-14

  Disclosed is a fluorine-containing polymer obtained by polymerizing a 1,6-diene-type ether compound represented by formula [1] and, for example, a (meth)acrylic acid compound represented by formula [2]. The fluorine-containing polymer shows high transparency, has a high glass transition point, and is soluble in a solvent and therefore has moldability. In the case where a (meth)acrylic unit has a reactive substituent, by utilizing the crosslinking reaction thereof, a thin film having high solvent resistance can be produced. In formulae [1] and [21, R 1 and R 2 each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, which may be substituted, R 3 represents a hydrogen atom, a fluorine atom, or a methyl group, and R 4 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, which may be substituted, or an aromatic group having 5 to 10 ring members, which may be substituted.

  本发明公开了一种含氟聚合物，其通过聚合由式[1]表示的1,6-二烯型醚化合物和例如由式[2]表示的（甲基）丙烯酸化合物等制得。该含氟聚合物具有高透明度，具有较高的玻璃转移温度，可溶于溶剂，因此具有成型性。在（甲基）丙烯酸单元具有反应性取代基的情况下，通过利用其交联反应，可以制备具有高溶剂耐受性的薄膜。在式[1]和[2]中，R1和R2分别独立表示氢原子或具有1至12个碳原子的烷基基团，可以被取代，R3表示氢原子、氟原子或甲基基团，R4表示氢原子、具有1至12个碳原子的烷基基团，可以被取代，或具有5至10个环成员的芳香族基团，可以被取代。
• TRIAZINE RING-CONTAINING POLYMER AND COMPOSITION FOR FILM FORMATION COMPRISING SAME
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20140371367A1

  公开（公告）日：2014-12-18

  Provided is a triazine ring-containing hyperbranched polymer comprising the repeating unit structure represented by formula (1) and having one or more triazine ring terminals, said one or more triazine ring terminals being capped with a compound that differs from the diamine compound serving as the starting material for the polymer and has at least two active hydrogen groups. In addition to the polymer itself exhibiting high heat resistance, high transparency, a high refractive index, high light resistance, high solubility, and low volume shrinkage, it is also possible to use the polymer to provide a composition for film formation capable of yielding a thick film having high hardness. (In formula (1), R and R′ each independently represent a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group, and Ar represents a divalent organic group containing an aromatic ring and/or a heterocyclic ring.)

  提供的是一种含有三嗪环的超支化聚合物，其重复单元结构由式（1）表示，并具有一个或多个三嗪环端基，其中，所述一个或多个三嗪环端基被与作为聚合物起始材料的二胺化合物不同的化合物封顶，该化合物具有至少两个活性氢基团。除了聚合物本身具有高耐热性、高透明度、高折射率、高耐光性、高溶解性和低体积收缩率之外，还可以使用该聚合物提供用于制备薄膜的组合物，该组合物能够产生具有高硬度的厚膜。（在式（1）中，R和R'各自独立地表示氢原子、烷基、烷氧基、芳基或芳烷基，Ar表示一个含有芳香环和/或杂环的二价有机基团。）
• AROMATIC POLYAMIDE AND FILM-FORMING COMPOSITION CONTAINING SAME
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20150252147A1

  公开（公告）日：2015-09-10

  An aromatic polyamide, which is obtained by reacting a benzene tricarboxylic acid or a derivative thereof with a diamine compound in the presence of a terminally blocked compound having a crosslinkable group and a functional group that is reactive with a benzene tricarboxylic acid such as 1-amino-2-propanol or a derivative thereof as expressed by scheme (1), and which has a weight average molecular weight of 1,000-100,000 in terms of polystyrene as determined by gel permeation chromatography, has good solubility in organic solvents, while maintaining heat resistance and transparency. A thick film can be formed using a film-forming composition that contains this aromatic polyamide.

  一种芳香族聚酰胺，通过在末端阻断化合物的存在下，将苯三羧酸或其衍生物与一种含有可交联基团和与苯三羧酸反应的官能团的二胺化合物反应而获得，例如1-氨基-2-丙醇或其衍生物，如图1所示。其相对于聚苯乙烯的重均分子量在1000-100000之间，通过凝胶渗透色谱法测定。该聚酰胺在有机溶剂中具有良好的溶解性，同时保持耐热性和透明度。使用含有该芳香族聚酰胺的成膜组合物可以形成厚膜。
• FILM-FORMING COMPOSITION
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20160017145A1

  公开（公告）日：2016-01-21

  A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker.

  含有三羰基苯超支化聚合物交联剂和三嗪基超支化物的成膜组合物，例如公式所示，可以形成一种优异的硬度和耐热性的薄膜，并且尽管添加了交联剂，折射率的降低也相对减少。
• NOVOLAC RESIN-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION USING BISPHENOL ALDEHYDE
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20160068709A1

  公开（公告）日：2016-03-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar 1 and Ar 2 each are C 6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  高干法蚀刻抗性、抗扭曲性、并对不平整部分表现出良好的平整和嵌入性的抗阻层薄膜形成组合物，包括通过反应含芳香环的有机化合物A和至少有两个芳香族碳环环团且具有酚羟基的醛B所获得的树脂，并具有芳香族碳环环团通过三级碳原子键合的结构。醛B可以是化合物式（1）的化合物：所获得的树脂可以具有式（2）的单元结构：其中Ar1和Ar2各自是C6-40芳基团。含芳香环的有机化合物A可以是芳香胺或含酚羟基的化合物。该组合物还可以含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成光刻图形，包括将抗阻层薄膜形成组合物涂覆在半导体基板上并烘烤以形成抗阻层薄膜。