2-(9-氧代占吨-2-基)丙酸1,8-二氮杂二环[5.4.0]十一-7-烯盐 | 1346753-05-6

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并吡喃
• 中文名称: 2-(9-氧代占吨-2-基)丙酸1,8-二氮杂二环[5.4.0]十一-7-烯盐
• 英文名称: 2H,3H,4H,6H,7H,8H,9H,10H-pyrimido[1,2-a]azepin-1-ium 2-(9-oxoxanthen-2-yl)propanoate
• 英文别名: 2,3,4,6,7,8,9,10-octahydro-1H-pyrimido[1,2-a]azepin-5-ium;2-(9-oxoxanthen-2-yl)propanoate
• CAS: 1346753-05-6
• 化学式: C25H28N2O4
• 分子量: 420.5
• InChiKey: ZLFMLTKPDRGWFB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.76
• 重原子数：
  31
• 可旋转键数：
  1
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  81.5
• 氢给体数：
  1
• 氢受体数：
  4

文献信息

• PHOTOCURABLE COMPOSITION
  申请人：Panasonic Intellectual Property Management Co., Ltd.

  公开号：EP3725813A1

  公开（公告）日：2020-10-21

  Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8 : 32.2 to 88.0 : 12.0, inclusive.

  所提供的光固化组合物包括 一种组分（A），它是一种丙烯酸酯化合物，在一个分子中含有一个或多个丙烯酰基； 一种组分（B），它是一种丙烯酸酯化合物，在一个分子中含有一个或多个丙烯酰基和一个或多个环氧基； 组分（C）是一种在一个分子中含有两个或两个以上硫醇基团的化合物； 一种成分（D），它是一种光引发剂；以及 作为光基发生器的组分（E）、 其中，组分（A）和组分（B）的总质量与组分（C）的质量之比范围为 67.8 : 32.2 至 88.0 : 12.0（含）。
• Photocurable composition
  申请人：Panasonic Intellectual Property Management Co., Ltd.

  公开号：US11053328B2

  公开（公告）日：2021-07-06

  Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

  所提供的光固化组合物包括 一种组分（A），它是一种丙烯酸酯化合物，在一个分子中含有一个或多个丙烯酰基； 一种组分（B），它是一种丙烯酸酯化合物，在一个分子中含有一个或多个丙烯酰基和一个或多个环氧基； 组分（C）是一种在一个分子中含有两个或两个以上硫醇基团的化合物； 一种成分（D），它是一种光引发剂；以及 作为光基发生器的组分（E）、 其中，组分（A）和组分（B）的总质量与组分（C）的质量之比范围为 67.8:32.2 至 88.0:12.0（含）。
• DIELECTRIC MATERIALS
  申请人：MERCK PATENT GMBH

  公开号：US20210062091A1

  公开（公告）日：2021-03-04

  The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.
• LIQUID CRYSTAL MATERIAL COMPOSITION AND DISPLAY DEVICE
  申请人：Japan Display Inc.

  公开号：US20210301206A1

  公开（公告）日：2021-09-30

  According to one embodiment, a liquid crystal material composition includes a liquid crystal mixture containing at least one kind of each of a first liquid crystalline compound, a second liquid crystalline compound and a third liquid crystalline compound, a polymerization initiator and a monomer compound including acryloyl groups at respective terminals.
• LOW TEMPERATURE CURE PHOTOIMAGEABLE DIELECTRIC COMPOSITIONS AND METHODS OF THEIR USE
  申请人：Nawrocki Daniel J.

  公开号：US20220146936A1

  公开（公告）日：2022-05-12

  Disclosed and claimed herein are photoimageable dielectric compositions for dielectric passivation layers, dielectric protection layers as well as dielectric redistribution layers for use in the manufacture of semiconductors, semiconductor packages and circuit board constructions. More specifically it relates to photoimageable polymers containing vinyl groups capable of being crosslinked during processing and post cured at lower temperatures and shorter times than conventional dielectric materials. The processed compositions are characterized by low dielectric constants and low dissipation factors as well as low moisture uptake, chemical and thermal stability, flexibility and excellent HAST (Highly Accelerated Stress Test) and TCT (Thermal Cycling Test) results. The invention also relates to low dk/df dielectric compositions that are not photoimageable